特性
- Fully automotive qualified to beyond AEC-Q101:
- -55 °C to +175 °C rating suitable for thermally demanding environments
- LFPAK88 package:
- Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
- Thin package and copper clip enables LFPAK88 to be highly efficient thermally
- LFPAK copper clip technology enabling improvements over wire bond packages by:
- Increased maximum current capability and excellent current spreading
- Improved RDSon
- Low source inductance
- Low thermal resistance Rth
- LFPAK Gull Wing leads:
- Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- Unique 40 V Trench 9 superjunction technology:
- Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
目标应用
- 12 V automotive systems
- 48 V DC/DC systems (on 12 V secondary side)
- Higher power motors, lamps and solenoid control
- Reverse polarity protection
- LED lighting
- Ultra high performance power switching
参数类型
| 型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BUK7S0R7-40H | SOT1235 | LFPAK88 | Production | N | 1 | 40 | 0.7 | 175 | 425 | 25 | 144 | 375 | 74 | 3 | Y | 11228 | 2363 | 2019-01-15 |
Package
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BUK7S0R7-40H | BUK7S0R7-40HJ ( 9346 605 62118 ) | Active | 7S0R740H |  LFPAK88 (SOT1235) | SOT1235 | REFLOW_BG-BD-1 | Reel 13" Q1/T1 |
文档 (9)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BUK7S0R7-40H | N-channel 40 V, 0.7 mΩ standard level MOSFET in LFPAK88 | Data sheet | 2019-05-07 |
| AN90003 | LFPAK MOSFET thermal design guide | Application note | 2021-01-22 |
| SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
| BUK7xxxx-40H_LTspice_V1_2 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-04-01 |
| BUK7S0R7-40H | BUK7S0R7-40H SPICE model | SPICE model | 2019-11-11 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2020-06-24 |
| BUK7S0R7_RCthermal_ | BUK7S0R7 RC thermal design | Thermal design | 2019-05-07 |
| BUK7S0R7-40H | BUK7S0R7-40H thermal model | Thermal model | 2019-05-07 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
| BUK7xxxx-40H_LTspice_V1_2 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-04-01 |
| BUK7S0R7-40H | BUK7S0R7-40H SPICE model | SPICE model | 2019-11-11 |
| BUK7S0R7_RCthermal_ | BUK7S0R7 RC thermal design | Thermal design | 2019-05-07 |
| BUK7S0R7-40H | BUK7S0R7-40H thermal model | Thermal model | 2019-05-07 |
订购、定价与供货
| 型号 | Orderable part number | Ordering code (12NC) | 包装 | Packing quantity | 在线购买 |
|---|---|---|---|---|---|
| BUK7S0R7-40H | BUK7S0R7-40HJ | 934660562118 | Reel 13" Q1/T1 | - | 订单产品 |
样品
安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.
样品订单通常需要2-4天寄送时间。
如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。