Features and benefits
Simplified circuit design
Reduced component count
Reduced pick and place costs
AEC-Q101 qualified
Applications
General-purpose switching and amplification
参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Configuration | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PIMZ2 | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | PNP | 2 | 200 | 50 | 150 | 120 | 560 | 150 | 100 | Y |
| PUMZ2 | SOT363 | TSSOP6 | 2.1 x 1.25 x 0.95 | PNP | 2 | 180 | 50 | 150 | 120 | 560 | 150 | 100 | Y |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PIMZ2 | PIMZ2,115 (934057906115) |
Active | M6 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_115 |
| PIMZ2,125 (934057906125) |
Active | M6 | SOT457_125 | ||||
| PUMZ2 | PUMZ2,115 (934058172115) |
Active | GZ% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PUMZ2,125 (934058172125) |
Active | GZ% | SOT363_125 |
文档 (20)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PIMZ2_PUMZ2 | NPN/PNP general-purpose double transistors | Data sheet | 2009-12-03 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| sot363_sv | Simplified outline: SOT363 | Block diagram | 2009-11-03 |
| sot457_sv | Simplified outline: SOT457 | Block diagram | 2009-11-04 |
| sym082 | Graphic symbol: PIMZ2_PUMZ2_5 | Block diagram | 2009-11-04 |
| sym083 | Graphic symbol: PIMZ2_PUMZ2_5 | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。