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PSMN0R7-25YLD

N-channel 25 V, 0.72 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 Technology

Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package. NextPowerS3 portfolio utilising Nexperia's unique "SchottkyPlus" technology delivers high efficiency, low spiking performance usually associated with MOSFETS with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PSMN0R7-25YLD PSMN0R7-25YLDX 934069083115 SOT1023 订单产品
PSMN0R7-25YLD/2 PSMN0R7-25YLD/2X 934667496115 SOT1023 订单产品

特性

  • 100% Avalanche tested at I(AS) = 190 A

  • Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies

  • Superfast switching with soft-recovery

  • Low spiking and ringing for low EMI designs

  • Unique "SchottkyPlus" technology; Schottky-like performance with < 1 μA leakage at 25 °C

  • Optimised for 4.5 V gate drive

  • Low parasitic inductance and resistance

  • High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 150 °C

  • Wave solderable; exposed leads for optimal visual solder inspection

目标应用

  • On-board DC:DC solutions for server and telecommunications

  • Secondary-side synchronous rectification in telecommunication applications

  • Voltage regulator modules (VRM)

  • Point-of-Load (POL) modules

  • Power delivery for V-core, ASIC, DDR, GPU, VGA and system components

  • Brushed and brushless motor control

  • Power OR-ing

参数类型

型号Package versionPackage nameProduct statusChannel typeNr of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)QG(tot) [typ] @ VGS = 10 V (nC)Ptot [max] (W)Qr [typ] (nC)VGSth [typ] (V)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
PSMN0R7-25YLDSOT1023LFPAK56E; Power-SO8ProductionN1250.720.9215030011.950.9110.215883.21.66N832029822014-10-10

PCB Symbol, Footprint and 3D Model

Model Name描述

Package

型号可订购的器件编号，（订购码(12NC)）状态标示封装尺寸版本回流焊/波峰焊包装
PSMN0R7-25YLDPSMN0R7-25YLDX
( 9340 690 83115 ) 		Active0D725L
LFPAK56E; Power-SO8
(SOT1023) 		SOT1023REFLOW_BG-BD-1
SOT1023_115
PSMN0R7-25YLD/2PSMN0R7-25YLD/2X
( 9346 674 96115 ) 		Active0D725L
LFPAK56E; Power-SO8
(SOT1023) 		SOT1023REFLOW_BG-BD-1
SOT1023_115

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符
PSMN0R7-25YLDPSMN0R7-25YLDXPSMN0R7-25YLD
PSMN0R7-25YLD/2PSMN0R7-25YLD/2XPSMN0R7-25YLD/2
品质及可靠性免责声明

文档 (18)

文件名称标题类型日期
PSMN0R7-25YLDN-channel 25 V, 0.72 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 TechnologyData sheet2018-03-13
AN10273Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication note2022-06-20
AN11158Understanding power MOSFET data sheet parametersApplication note2020-07-06
AN11160Designing RC SnubbersApplication note2023-02-03
AN11156Using Power MOSFET Zth CurvesApplication note2021-01-04
AN11243Failure signature of Electrical Overstress on Power MOSFETsApplication note2017-12-21
AN11261RC Thermal ModelsApplication note2021-03-18
AN11599Using power MOSFETs in parallelApplication note2016-07-13
AN10874_ZHLFPAK MOSFET thermal design guide, Chinese versionApplication note2020-04-30
AN11113_ZHLFPAK MOSFET thermal design guide - Part 2Application note2020-04-30
T9_SOT1023_PSMN0R7-25YLD_Nexperia_Quality_documentProduct Quality Quick Reference InformationQuality document2022-08-29
Reliability_information_t9_sot1023Reliability qualification informationQuality document2022-08-29
PSMN0R7-25YLDPSMN0R7-25YLD SPICE modelSPICE model2016-04-07
TN00008Power MOSFET frequently asked questions and answersTechnical note2023-01-12
PSMN0R7-25YLD_RC_Thermal_ModelPSMN0R7-25YLD Thermal design modelThermal design2021-01-18
PSMN0R7-25YLDPSMN0R7-25YLD Thermal modelThermal model2016-04-07
SOT1023_115LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientationPacking information2022-06-07
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
PSMN0R7-25YLDPSMN0R7-25YLD SPICE modelSPICE model2016-04-07
PSMN0R7-25YLD_RC_Thermal_ModelPSMN0R7-25YLD Thermal design modelThermal design2021-01-18
PSMN0R7-25YLDPSMN0R7-25YLD Thermal modelThermal model2016-04-07

PCB Symbol, Footprint and 3D Model

Model Name描述

订购、定价与供货

型号Orderable part numberOrdering code (12NC)包装Packing quantity在线购买
PSMN0R7-25YLDPSMN0R7-25YLDX934069083115SOT1023_115- 订单产品
PSMN0R7-25YLD/2PSMN0R7-25YLD/2X934667496115SOT1023_115- 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册