特性
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100% Avalanche tested at I(AS) = 190 A
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Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
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Superfast switching with soft-recovery
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Low spiking and ringing for low EMI designs
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Unique "SchottkyPlus" technology; Schottky-like performance with < 1 μA leakage at 25 °C
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Optimised for 4.5 V gate drive
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Low parasitic inductance and resistance
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High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 150 °C
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Wave solderable; exposed leads for optimal visual solder inspection
目标应用
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On-board DC:DC solutions for server and telecommunications
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Secondary-side synchronous rectification in telecommunication applications
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Voltage regulator modules (VRM)
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Point-of-Load (POL) modules
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Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
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Brushed and brushless motor control
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Power OR-ing
参数类型
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN0R7-25YLD | SOT1023 | LFPAK56E; Power-SO8 | Production | N | 1 | 25 | 0.72 | 0.92 | 150 | 300 | 11.9 | 50.9 | 110.2 | 158 | 83.2 | 1.66 | N | 8320 | 2982 | 2014-10-10 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
---|---|
Package
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PSMN0R7-25YLD | PSMN0R7-25YLDX ( 9340 690 83115 ) | Active | 0D725L | ![]() LFPAK56E; Power-SO8 (SOT1023) | SOT1023 | REFLOW_BG-BD-1 | SOT1023_115 |
PSMN0R7-25YLD/2 | PSMN0R7-25YLD/2X ( 9346 674 96115 ) | Active | 0D725L | ![]() LFPAK56E; Power-SO8 (SOT1023) | SOT1023 | REFLOW_BG-BD-1 | SOT1023_115 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
PSMN0R7-25YLD | PSMN0R7-25YLDX | PSMN0R7-25YLD | ![]() | |
PSMN0R7-25YLD/2 | PSMN0R7-25YLD/2X | PSMN0R7-25YLD/2 | ![]() |
文档 (18)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN0R7-25YLD | N-channel 25 V, 0.72 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 Technology | Data sheet | 2018-03-13 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11160 | Designing RC Snubbers | Application note | 2023-02-03 |
AN11156 | Using Power MOSFET Zth Curves | Application note | 2021-01-04 |
AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2017-12-21 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
T9_SOT1023_PSMN0R7-25YLD_Nexperia_Quality_document | Product Quality Quick Reference Information | Quality document | 2022-08-29 |
Reliability_information_t9_sot1023 | Reliability qualification information | Quality document | 2022-08-29 |
PSMN0R7-25YLD | PSMN0R7-25YLD SPICE model | SPICE model | 2016-04-07 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
PSMN0R7-25YLD_RC_Thermal_Model | PSMN0R7-25YLD Thermal design model | Thermal design | 2021-01-18 |
PSMN0R7-25YLD | PSMN0R7-25YLD Thermal model | Thermal model | 2016-04-07 |
SOT1023_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-06-07 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN0R7-25YLD | PSMN0R7-25YLD SPICE model | SPICE model | 2016-04-07 |
PSMN0R7-25YLD_RC_Thermal_Model | PSMN0R7-25YLD Thermal design model | Thermal design | 2021-01-18 |
PSMN0R7-25YLD | PSMN0R7-25YLD Thermal model | Thermal model | 2016-04-07 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
---|---|
订购、定价与供货
型号 | Orderable part number | Ordering code (12NC) | 包装 | Packing quantity | 在线购买 |
---|---|---|---|---|---|
PSMN0R7-25YLD | PSMN0R7-25YLDX | 934069083115 | SOT1023_115 | - | 订单产品 |
PSMN0R7-25YLD/2 | PSMN0R7-25YLD/2X | 934667496115 | SOT1023_115 | - | 订单产品 |
样品
安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.
样品订单通常需要2-4天寄送时间。
如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.