特性
- Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
- Superfast switching with soft-recovery; s-factor > 1
- Low spiking and ringing for low EMI designs
- Unique “SchottkyPlus” technology; Schottky-like performance with < 1µA leakage at 25°C
- Optimised for 4.5 V gate drive
- Low parasitic inductance and resistance
- High reliability clip bonded and solder die attach Mini Power SO8 package; no glue, no wire bonds, qualified to 175°C
- Exposed leads for optimal visual solder inspection
目标应用
- On-board DC-to-DC solutions for server and telecommunications
- Secondary-side synchronous rectification in telecommunication applications
- Voltage regulator modules (VRM)
- Point-of-Load (POL) modules
- Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
- Brushed and brushless motor control
参数类型
型号 | Package version | Package name | Product status | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN6R4-30MLD | SOT1210 | LFPAK33 | Production | N | 1 | 30 | 6.3 | 8.3 | 175 | 66 | 1.8 | 6.5 | 13.7 | 51 | 12.6 | 1.7 | N | 832 | 587 | 2013-10-02 |
Package
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PSMN6R4-30MLD | PSMN6R4-30MLDX ( 9340 680 65115 ) | Active | 6D430L | ![]() LFPAK33 (SOT1210) | SOT1210 | Reel 7” Q1/T1 or Q2/T3 |
文档 (14)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN6R4-30MLD | N-channel 30 V, 6.4 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology | Data sheet | 2019-03-06 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN90003 | LFPAK MOSFET thermal design guide | Application note | 2021-01-22 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
PSMN6R4-30MLD | PSMN6R4-30MLD.lib SPICE model | SPICE model | 2021-03-11 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2020-06-24 |
PSMN6R4-30MLD | PSMN6R4-30MLD thermal model | Thermal model | 2021-03-11 |
CauerModel_PSMN6R4-30MLD | PSMN6R4-30MLD Cauer thermal model | Thermal model | 2021-03-11 |
FosterModel_PSMN6R4-30MLD | PSMN6R4-30MLD Foster thermal model | Thermal model | 2021-03-11 |
PSMN6R4-30MLD_Cauer | PSMN6R4-30MLD Cauer thermal model | Thermal model | 2021-03-11 |
PSMN6R4-30MLD_Foster | PSMN6R4-30MLD Foster thermal model | Thermal model | 2021-03-11 |
PSMN6R4-30MLD | PSMN6R4-30MLD FloTherm thermal model | Thermal model | 2021-04-07 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN6R4-30MLD | PSMN6R4-30MLD.lib SPICE model | SPICE model | 2021-03-11 |
PSMN6R4-30MLD | PSMN6R4-30MLD thermal model | Thermal model | 2021-03-11 |
CauerModel_PSMN6R4-30MLD | PSMN6R4-30MLD Cauer thermal model | Thermal model | 2021-03-11 |
FosterModel_PSMN6R4-30MLD | PSMN6R4-30MLD Foster thermal model | Thermal model | 2021-03-11 |
PSMN6R4-30MLD_Cauer | PSMN6R4-30MLD Cauer thermal model | Thermal model | 2021-03-11 |
PSMN6R4-30MLD_Foster | PSMN6R4-30MLD Foster thermal model | Thermal model | 2021-03-11 |
PSMN6R4-30MLD | PSMN6R4-30MLD FloTherm thermal model | Thermal model | 2021-04-07 |
订购、定价与供货
型号 | Orderable part number | Ordering code (12NC) | 包装 | 在线购买 |
---|---|---|---|---|
PSMN6R4-30MLD | PSMN6R4-30MLDX | 934068065115 | Reel 7” Q1/T1 or Q2/T3 | 订单产品 |
样品
安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.
样品订单通常需要2-4天寄送时间。
如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。