特性
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Trench MOSFET technology
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Extremely fast switching
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Logic level compatible
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Subminiature surface mounting
目标应用
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High-speed line driver
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Relay driver
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Telephone ringer
参数类型
| 型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | VGS [max] (V) | Tj [max] (°C) | ID [max] (A) | Ptot [max] (W) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSS123 NRND | SOT23 | SOT23 | Not for design in | N | 1 | 100 | 20 | 150 | 0.15 | 0.25 | N | 23 | 6 | 2011-01-24 |
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
|---|---|
Package
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BSS123 NRND | BSS123,215 ( 9339 463 40215 ) | Active | SA% |  (SOT23) | SOT23 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT23_215 |
文档 (15)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BSS123 | N-channel TrenchMOS (tm) transistor Logic Level FET | Data sheet | 2002-09-30 |
| AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
| AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
| AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2017-12-21 |
| AN11158_ZH | Understanding power MOSFET data sheet parameters | Application note | 2021-01-04 |
| AN11261 | RC Thermal Models | Application note | 2021-03-18 |
| AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
| AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
| BSS123_05_03_2012 | BSS123.05_03_2012 Spice parameter | SPICE model | 2012-04-13 |
| BSS123 | BSS123 SPICE model | SPICE model | 2012-06-08 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
| SOT23_215 | Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2020-04-29 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BSS123_05_03_2012 | BSS123.05_03_2012 Spice parameter | SPICE model | 2012-04-13 |
| BSS123 | BSS123 SPICE model | SPICE model | 2012-06-08 |
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
|---|---|
订购、定价与供货
| 型号 | Orderable part number | Ordering code (12NC) | 包装 | Packing quantity | 在线购买 |
|---|---|---|---|---|---|
| BSS123 | BSS123,215 | 933946340215 | SOT23_215 | - | 订单产品 |
样品
安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.
样品订单通常需要2-4天寄送时间。
如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.