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PMCM6501UPE

20 V, P-channel Trench MOSFET

P-channel enhancement mode Field-Effect Transistor (FET) in a 6 bumps Wafer Level Chip-Size Package (WLCSP) using Trench MOSFET technology.

Features and benefits

  • Low threshold voltage

  • Ultra small package: 0.98 x 1.48 x 0.35 mm

  • Trench MOSFET technology

  • ElectroStatic Discharge (ESD) protection > 2 kV HBM

Applications

  • Battery switch

  • High-speed line driver

  • High-side loadswitch

  • Switching circuits

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) VGS [max] (V) RDSon [max] @ VGS = 4.5 V (mΩ) RDSon [max] @ VGS = 2.5 V (mΩ) integrated gate-source ESD protection diodes VESD HBM (V) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMCM6501UPE WLCSP6_3-2 WLCSP6 Production P 1 -20 8 30 44 Y 2000 150 -7.3 5.4 19.1 0.556 -0.6 N 1420 210 2017-04-17

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
PMCM6501UPE PMCM6501UPEZ
(934070324023)		 Active AF WLCSP6_3-2
WLCSP6
(WLCSP6_3-2) 		WLCSP6_3-2 Not available

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PMCM6501UPE PMCM6501UPEZ PMCM6501UPE rohs rhf rhf
品质及可靠性免责声明

Series

文档 (15)

文件名称 标题 类型 日期
PMCM6501UPE 20 V, P-channel Trench MOSFET Data sheet 2017-07-03
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13
nexperia_document_leaflet_SsMOS_for_mobile_2022-CHN 适合移动和便携式设备的 大批量小信号MOSFET， 采用WLCSP和无引脚DFN封装 Leaflet 2022-07-04
nexperia_document_leaflet_SsMOS_for_mobile_2022 High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages Leaflet 2022-07-04
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
WLCSP6_3-2 wafer level chip-size package; 6 bumps (3 x 2) Package information 2022-07-13
pmcm4401vne-ssmos_fr pmcm4401vne-ssmos_fr Reflow soldering 2015-07-10
PMCM6501UPE PMCM6501UPE SPICE model SPICE model 2017-10-21
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PMCM6501UPE PMCM6501UPE SPICE model SPICE model 2017-10-21
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PMCM6501UPE PMCM6501UPEZ 934070324023 Active WLCSP6_3-2_023 4,500 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PMCM6501UPE PMCM6501UPEZ 934070324023 WLCSP6_3-2 订单产品