可订购部件
| 型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
|---|---|---|---|---|
| PMCXB900UE | PMCXB900UEZ | 934067143147 | SOT1216 | 订单产品 |
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20 V, complementary N/P-channel Trench MOSFET
Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Features and benefits
Trench MOSFET technology
Very low threshold voltage for portable applications: VGS(th) = 0.7 V
Leadless ultra small and ultra thin SMD plastic package: 1.1 × 1.0 × 0.37 mm
ElectroStatic Discharge (ESD) protection > 1 kV HBM
Applications
Relay driver
High-speed line driver
Level shifter
Power management in battery-driven portables
参数类型
| 型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | VGS [max] (V) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | VESD (kV) (kV) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | Ptot [max] (W) | VGSth @25 C [min] (V) | VGSth @25 C [min] (V) | VGSth [typ] (V) | VGSth [max] @25 C (V) | VGSth [max] @25 C (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMCXB900UE | SOT1216 | DFN1010B-6 | Production | N/P | 2 | 20 | 8 | 620 | 850 | 1000 | 150 | 0.6 | 0.1 | 0.4 | 0.265 | -0.45 | 0.45 | 0.7 | -0.95 | 0.95 | N | 21.3 | 5.4 | 2013-10-07 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PMCXB900UE | PMCXB900UEZ (934067143147) |
Active | 10 00 00 |
DFN1010B-6 (SOT1216) |
SOT1216 |
REFLOW_BG-BD-1
|
SOT1216_147 |
文档 (19)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PMCXB900UE | 20 V, complementary N/P-channel Trench MOSFET | Data sheet | 2017-05-19 |
| AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
| AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
| AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
| AN11261 | RC Thermal Models | Application note | 2021-03-18 |
| AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT1216 | 3D model for products with SOT1216 package | Design support | 2019-10-07 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022-CHN | 适合移动和便携式设备的 大批量小信号MOSFET， 采用WLCSP和无引脚DFN封装 | Leaflet | 2022-07-04 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022 | High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages | Leaflet | 2022-07-04 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1010B-6_SOT1216_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
| SOT1216 | plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.35 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | Package information | 2022-09-08 |
| SOT1216_147 | DFN1010B-6; Reel pack for SMD, 7''; Q2/T3 product orientation | Packing information | 2020-06-12 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PMCXB900UE_12_12_2012 | PMCXB900UE Spice model | SPICE model | 2013-12-13 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PMCXB900UE_12_12_2012 | PMCXB900UE Spice model | SPICE model | 2013-12-13 |
| SOT1216 | 3D model for products with SOT1216 package | Design support | 2019-10-07 |
订购、定价与供货
| 型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
|---|---|---|---|---|---|---|
| PMCXB900UE | PMCXB900UEZ | 934067143147 | Active | SOT1216_147 | 5,000 |
|
样品
作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.