化学成分 PESD3V3T1BL

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号	封装	封装说明	总产品重量
PESD3V3T1BL	SOD882	SOD2	0.91408 mg

12NC	版本	无铅焊接			焊接			处理周期数	组装厂	RHF指示符
12NC	版本	MSL	PPT	MPPT	MSL	PPT	MPPT	处理周期数	组装厂	RHF指示符
934660339315	4	1	260	30 s	1	235	20 s	3	D-22529 HAMBURG, Germany; Dongguan, China

次组件	材料组	物质	CAS登录号	重量（毫克）	次组件重量(%)	总产品重量(%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.00760	76.00000	0.83144
	Polymer	Bisphenol-F/Formaldehyde/Epichlorohydrin copolymer	9003-36-5	0.00105	10.47000	0.11454
		Phenolic resin	Proprietary	0.00135	13.53000	0.14802
		subTotal		0.01000	100.00000	1.09400

Die	Doped silicon	Silicon (Si)	7440-21-3	0.02000	100.00000	2.18799
		subTotal		0.02000	100.00000	2.18799

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.38741	94.49000	42.38240
		Magnesium (Mg)	7439-95-4	0.00082	0.20000	0.08971
		Nickel (Ni) - cas no. 7440-02-0	7440-02-0	0.01292	3.15000	1.41290
		Silicon (Si)	7440-21-3	0.00283	0.69000	0.30949
	Pure metal layer	Gold (Au)	7440-57-5	0.00012	0.03000	0.01346
		Nickel (Ni) - cas no. 7440-02-0	7440-02-0	0.00521	1.27000	0.56964
		Palladium (Pd)	7440-05-3	0.00070	0.17000	0.07625
		subTotal		0.41000	100.00000	44.85385

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.09000	20.00000	9.84597
		Silica fused	60676-86-0	0.29025	64.50000	31.75324
	Flame retardant	Metal hydroxide	Proprietary	0.01350	3.00000	1.47689
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.00225	0.50000	0.24615
	Pigment	Carbon black	1333-86-4	0.00135	0.30000	0.14769
	Polymer	Phenol Formaldehyde resin (generic)	9003-35-4	0.00990	2.20000	1.08306
		Phenolic resin	Proprietary	0.01125	2.50000	1.23075
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.03150	7.00000	3.44609
		subTotal		0.45000	100.00000	49.22984

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00000	0.01000	0.00022
		Bismuth (Bi)	7440-69-9	0.00000	0.02000	0.00044
		Iron (Fe)	7439-89-6	0.00000	0.01000	0.00022
		Lead (Pb)	7439-92-1	0.00000	0.01000	0.00022
	Tin solder	Tin (Sn)	7440-31-5	0.01999	99.95000	2.18690
		subTotal		0.02000	100.00000	2.18800

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00004
	Pure metal	Gold (Au)	7440-57-5	0.00408	99.99000	0.44631
		subTotal		0.00408	100.00000	0.44635

		total		0.91408	100.00000	100.00000

备注：
¹此处是对使用物质的通用描述，因实际组成物质为专有成分，也没有正式的CAS登录号。如果有CAS登录号，此处显示最接近的结果。

免责声明
本文档中提供的所有信息只为考察或参考目的。本文档中的所有信息据信是准确和可靠的。但是，安世半导体对此处所含信息的准确性或完整性不做任何说明或保证，并对因使用此信息而带来的后果不承担任何责任。安世半导体可能随时更改本文档所发布的信息，恕不另行通知。来自不同生产地的产品可能存在细微差异。本文档将取代并替换之前就此提供的所有信息。本文档中的任何信息均不得被理解或解释为出售可接受的产品的要约，或者授予、转让或暗示任何版权、专利或其他工业或知识产权的任何许可。

免责声明

本文档中提供的所有信息只为考察或参考目的。本文档中的所有信息据信是准确和可靠的。但是，安世半导体对此处所含信息的准确性或完整性不做任何说明或保证，并对因使用此信息而带来的后果不承担任何责任。安世半导体可能随时更改本文档所发布的信息，恕不另行通知。来自不同生产地的产品可能存在细微差异。本文档将取代并替换之前就此提供的所有信息。本文档中的任何信息均不得被理解或解释为出售可接受的产品的要约，或者授予、转让或暗示任何版权、专利或其他工业或知识产权的任何许可。

中国RoHS信息

Name of the part 部件名称	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
Adhesive 粘合剂	O	O	O	O	O	O
Die 晶粒	O	O	O	O	O	O
Lead Frame 引线框	O	O	O	O	O	O
Mould Compound 注塑胶料	O	O	O	O	O	O
Post-Plating 后电镀	O	O	O	O	O	O
Wire 线	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.

disclaimer 免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

disclaimer
免责声明

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.