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化学成分 PSMN2R9-100SSE

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号封装封装说明总产品重量
PSMN2R9-100SSESOT1235LFPAK88336.30140 mg
12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
MSLPPTMPPTMSLPPTMPPT
934661731118512601260Seremban, Malaysia; Cabuyao, Philippines; Cardiff, Great Britain; Manchester, United Kingdom; Sherman, United States Of AmericaLeaded
次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
DieDoped siliconSilicon (Si)7440-21-38.10840100.000002.41105
subTotal8.10840100.000002.41105
ClipCopper alloyCopper (Cu)7440-50-846.7774299.8600013.90937
Iron (Fe)7439-89-60.051530.110000.01532
Phosphorus (P)7723-14-00.014050.030000.00418
subTotal46.84300100.0000013.92887
Lead FrameCopper alloyCopper (Cu)7440-50-8172.5480999.8600051.30758
Iron (Fe)7439-89-60.224630.130000.06679
Phosphorus (P)7723-14-00.051840.030000.01541
subTotal172.79000100.0000051.38978
Mould CompoundFillerSilica -amorphous-7631-86-914.4075015.000004.28410
Silica fused60676-86-071.5572574.5000021.27771
PigmentCarbon black1333-86-40.480250.500000.14280
PolymerEpoxy resin systemProprietary4.802505.000001.42803
Phenolic resinProprietary4.802505.000001.42803
subTotal96.05000100.0000028.56067
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00015
Tin alloyTin (Sn)7440-31-54.8795199.990001.45093
subTotal4.88000100.000001.45108
Solder PasteImpurityAntimony (Sb)7440-36-00.001610.030000.00048
Lead alloyLead (Pb)7439-92-14.9563992.470001.47379
Silver (Ag)7440-22-40.134002.500000.03985
Tin (Sn)7440-31-50.268005.000000.07969
subTotal5.36000100.000001.59381
Solder PasteImpurityAntimony (Sb)7440-36-00.000680.030000.00020
Lead alloyLead (Pb)7439-92-12.0990792.470000.62416
Silver alloySilver (Ag)7440-22-40.056752.500000.01687
Tin alloyTin (Sn)7440-31-50.113505.000000.03375
subTotal2.27000100.000000.67498
total336.30140100.00000100.00000
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