双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HC244-Q100; 74HCT244-Q100

Octal buffer/line driver; 3-state

The 74HC244-Q100; 74HCT244-Q100 is an 8-bit buffer/line driver with 3-state outputs. The device can be used as two 4-bit buffers or one 8-bit buffer. The device features two output enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • CMOS low power dissipation

  • High noise immunity

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Input levels:

    • For 74HC244-Q100: CMOS level

    • For 74HCT244-Q100: TTL level

  • Octal bus interface

  • Non-inverting 3-state outputs

  • Complies with JEDEC standards:

    • JESD8C (2.7 V to 3.6 V)

    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74HC244BQ-Q100 2.0 - 6.0 CMOS ± 7.8 36 8 low -40~125 78 9.4 50 DHVQFN20
74HC244D-Q100 2.0 - 6.0 CMOS ± 7.8 36 8 low -40~125 85 27.5 61 SO20
74HC244PW-Q100 2.0 - 6.0 CMOS ± 7.8 36 8 low -40~125 100 4.6 44.9 TSSOP20
74HCT244BQ-Q100 4.5 - 5.5 TTL ± 6 36 8 low -40~125 78 9.4 50 DHVQFN20
74HCT244D-Q100 4.5 - 5.5 TTL ± 6 36 8 low -40~125 85 27.5 61 SO20
74HCT244PW-Q100 4.5 - 5.5 TTL ± 6 36 8 low -40~125 100 4.6 44.9 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HC244BQ-Q100 74HC244BQ-Q100,115
(935298912115)		 Active HC244 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74HC244D-Q100 74HC244D-Q100,118
(935298913118)		 Active 74HC244D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74HC244PW-Q100 74HC244PW-Q100,118
(935298914118)		 Active HC244 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118
74HCT244BQ-Q100 74HCT244BQ-Q100,11
(935298915115)		 Active HCT244 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74HCT244D-Q100 74HCT244D-Q100,118
(935298916118)		 Active 74HCT244D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74HCT244PW-Q100 74HCT244PW-Q100,11
(935298917118)		 Active HCT244 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HC244BQ-Q100 74HC244BQ-Q100,115 74HC244BQ-Q100 rohs rhf rhf
74HC244D-Q100 74HC244D-Q100,118 74HC244D-Q100 rohs rhf rhf
74HC244PW-Q100 74HC244PW-Q100,118 74HC244PW-Q100 rohs rhf rhf
74HCT244BQ-Q100 74HCT244BQ-Q100,11 74HCT244BQ-Q100 rohs rhf rhf
74HCT244D-Q100 74HCT244D-Q100,118 74HCT244D-Q100 rohs rhf rhf
74HCT244PW-Q100 74HCT244PW-Q100,11 74HCT244PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74HC_HCT244_Q100 Octal buffer/line driver; 3-state Data sheet 2024-08-05
AN11044 Pin FMEA 74HC/74HCT family Application note 2019-01-09
AN263 Power considerations when using CMOS and BiCMOS logic devices Application note 2023-02-07
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2024-11-15
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
hc HC/HCT Spice model SPICE model 2022-02-17
HCT_USER_GUIDE HC/T User Guide User manual 1997-10-31
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
hc HC/HCT Spice model SPICE model 2022-02-17

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