双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HC590

8-bit binary counter with output register; 3-state

The 74HC590 is an 8-bit binary counter with a storage register and 3-state outputs. The storage register has parallel (Q0 to Q7) outputs. The binary counter features master reset counter (MRC) and count enable (CE) inputs. The counter and storage register have separate positive edge triggered clock (CPC and CPR) inputs. If both clocks are connected together, the counter state is always one count ahead of the register. Internal circuitry prevents clocking from the clock enable. A ripple carry output (RCO) is provided for cascading. Cascading is accomplished by connecting RCO of the first stage to CE of the second stage. Cascading for larger count chains can be accomplished by connecting RCO of each stage to the counter clock (CPC) input of the following stage. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

Features and benefits

  • Wide supply voltage range from 2.0 V to 6.0 V

  • CMOS low power dissipation

  • High noise immunity

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8C (2.7 V to 3.6 V)
    • JESD7A (2.0 V to 6.0 V)

  • CMOS input levels

  • Counter and register have independent clock inputs

  • Counter has master reset

  • Multiple package options

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Output drive capability (mA) Logic switching levels tpd (ns) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74HC590BQ 2.0 - 6.0 ± 5.2 CMOS 19 low -40~125 88 10.3 56 DHVQFN16
74HC590D 2.0 - 6.0 ± 5.2 CMOS 19 low -40~125 87 7.4 46 SO16
74HC590PW 2.0 - 6.0 ± 5.2 CMOS 19 low -40~125 120 3.4 49.1 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HC590BQ 74HC590BQ,115
(935278834115)		 Active HC590 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74HC590D 74HC590D,118
(935278827118)		 Active 74HC590D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74HC590PW 74HC590PW,118
(935278836118)		 Active HC590 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HC590BQ 74HC590BQ,115 74HC590BQ rohs rhf rhf
74HC590D 74HC590D,118 74HC590D rohs rhf rhf
74HC590PW 74HC590PW,118 74HC590PW rohs rhf rhf
品质及可靠性免责声明

文档 (19)

文件名称 标题 类型 日期
74HC590 8-bit binary counter with output register; 3-state Data sheet 2024-01-17
AN11044 Pin FMEA 74HC/74HCT family Application note 2019-01-09
AN90063 Questions about package outline drawings Application note 2025-06-13
001aac543 Block diagram: 74HC590BQ, 74HC590D, 74HC590N, 74HC590PW Block diagram 2009-11-03
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
HCT_USER_GUIDE HC/T User Guide User manual 1997-10-31
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22

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