双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HCS259

8-bit addressable latch with Schmitt-trigger inputs

The 74HCS259 is an 8-bit addressable latch. The device features four modes of operation. In the addressable latch mode, data on the D input is written into the latch addressed by the inputs A0 to A3. The addressed latch will follow the data input, non-addressed latches will retain their previous states. In memory mode, all latches retain their previous states and are unaffected by the data or address inputs. In the 3-to-8 decoding or demultiplexing mode, the addressed output follows the D input and all other outputs are LOW. In the reset mode, all outputs are forced LOW and unaffected by the data or address inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

Features and benefits

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V

  • Combined demultiplexer and 8-bit latch

  • Serial-to-parallel capability

  • Output from each storage bit available

  • Random (addressable) data entry

  • Easily expandable

  • Common reset input

  • Useful as a 3-to-8 active HIGH decoder

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS259BQ 2.0 - 6.0 CMOS low -40~125 DHVQFN16
74HCS259D 2.0 - 6.0 CMOS low -40~125 SO16
74HCS259PW 2.0 - 6.0 CMOS low -40~125 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HCS259BQ 74HCS259BQX
(935692402115)		 Active S259 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74HCS259D 74HCS259DJ
(935692404118)		 Active 74HCS259D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74HCS259PW 74HCS259PWJ
(935692400118)		 Active S259 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HCS259BQ 74HCS259BQX 74HCS259BQ rohs rhf rhf
74HCS259D 74HCS259DJ 74HCS259D rohs rhf rhf
74HCS259PW 74HCS259PWJ 74HCS259PW rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74HCS259 8-bit addressable latch with Schmitt-trigger inputs Data sheet 2025-10-30
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs259 74HCS259 IBIS model IBIS model 2025-10-31
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs259 74HCS259 IBIS model IBIS model 2025-10-31

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