双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC157A-Q100

Quad 2-input multiplexer

the control of a common select input (S). The four outputs present the selected data in the true (non-inverted) form. The enable input (E) is active LOW. When pin E is HIGH, all of the outputs (1Y to 4Y) are forced LOW regardless of all the other input conditions. Moving the data from two groups of registers to four common output buses is a common use of the 74LVC157A. The state of the common data select input (S) determines the particular register from which the data comes. It can also be used as function generator.

It is useful for implementing highly irregular logic by generating any 4 of the 16 different functions of two variables with one variable common.

The device is the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to pin S.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

  • 5 V tolerant inputs for interfacing with 5 V logic

  • Wide supply voltage range from 1.2 V to 3.6 V

  • CMOS low power consumption

  • Direct interface with TTL levels

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC157ABQ-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 2.5 low -40~125 94 14.9 64 DHVQFN16
74LVC157AD-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 2.5 low -40~125 93 10.3 53.3 SO16
74LVC157APW-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 2.5 low -40~125 126 4.9 56.4 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC157ABQ-Q100 74LVC157ABQ-Q100X
(935299278115)		 Active VC157A SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74LVC157AD-Q100 74LVC157AD-Q100J
(935299279118)		 Active 74LVC157AD SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74LVC157APW-Q100 74LVC157APW-Q100J
(935299281118)		 Active LVC157A SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC157ADB-Q100 74LVC157ADB-Q100J
(935301553118)		 Obsolete VC157A SOT338-1
SSOP16
(SOT338-1) 		SOT338-1 SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE
暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC157ABQ-Q100 74LVC157ABQ-Q100X 74LVC157ABQ-Q100 rohs rhf rhf
74LVC157AD-Q100 74LVC157AD-Q100J 74LVC157AD-Q100 rohs rhf rhf
74LVC157APW-Q100 74LVC157APW-Q100J 74LVC157APW-Q100 rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC157ADB-Q100 74LVC157ADB-Q100J 74LVC157ADB-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (23)

文件名称 标题 类型 日期
74LVC157A_Q100 Quad 2-input multiplexer Data sheet 2024-02-12
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN263 Power considerations when using CMOS and BiCMOS logic devices Application note 2023-02-07
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
lvc157a lvc157a IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
SSOP16_SOT338-1_mk plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT338-1 plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Package information 2022-06-20
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
lvc lvc Spice model SPICE model 2013-05-07
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
lvc157a lvc157a IBIS model IBIS model 2013-04-08
lvc lvc Spice model SPICE model 2013-05-07

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