双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HCS174

Hex D-type flip-flop with Schmitt-trigger inputs; reset; positive-edge trigger

The 74HCS174 is a hex positive edge-triggered D-type flip-flops with individual data inputs (Dn) and outputs (Qn). The common clock (CP) and master reset (MR) inputs load and reset all flip-flops simultaneously. The D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition is stored in the flip-flop and appears at the Q output. A LOW on MR causes the flip-flops and outputs to be reset LOW. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

Features and benefits

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V

  • Six edge-triggered D-type flip-flops

  • Asynchronous master reset

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS174BQ 2.0 - 6.0 CMOS low -40~125 DHVQFN16
74HCS174D 2.0 - 6.0 CMOS low -40~125 SO16
74HCS174PW 2.0 - 6.0 CMOS low -40~125 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HCS174BQ 74HCS174BQX
(935692432115)		 Active S174 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74HCS174D 74HCS174DJ
(935692434118)		 Active 74HCS174D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74HCS174PW 74HCS174PWJ
(935692430118)		 Active S174 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HCS174BQ 74HCS174BQX 74HCS174BQ rohs rhf rhf
74HCS174D 74HCS174DJ 74HCS174D rohs rhf rhf
74HCS174PW 74HCS174PWJ 74HCS174PW rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74HCS174 Hex D-type flip-flop with Schmitt-trigger inputs; reset; positive-edge trigger Data sheet 2025-10-24
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs174 74HCS174 IBIS model IBIS model 2025-10-26
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs174 74HCS174 IBIS model IBIS model 2025-10-26

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