Nexperia's DHXQFN is the industry's smallest footprint package in 14, 16, 20 and 24 pin and offers significant space saving on PCB. The small footprint of DHXQFN package enables devices to be placed closer to the bypass capacitor. This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high frequency applications since the traces between logic device and capacitor are shorter.
主要特性和优势
Features and benefits
Smallest and thinnest package in 14, 16, 20 and 24
Significant space savings up to 25% on a PCB area compare to competitors’ packages (16 pin package as a reference)
45% of space saving compare to industry standard DQFN package (16 pin package as a reference)
Small footprint and thinness of the package make it conducive for space constrained applications
Delivers better performance due to closer placement of supply bypass capacitor C
Control plan in place for process, product and package
RoHS and dark-green compliant
Parametric search
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Analog & Logic ICs
| 型号 | 描述 | 状态 | 快速访问 |
|---|---|---|---|
| 74AVC4T245BZ | 4-bit dual supply translating transceiver with configurable voltage translation; 3-state | Production | |
| 74AVC8T245BZ | 8-bit dual supply translating transceiver with configurable voltage translation; 3-state | Production | |
| 74HC595BZ | 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state | Production | |
| 74LV14ABZ | Hex inverting Schmitt trigger | Production | |
| 74LVC14ABZ | Hex inverting Schmitt trigger with 5 V tolerant input | Production | |
| 74LVC244ABZ | Octal buffer/line driver; 3-state | Production | |
| 74LVC245ABZ | Octal bus transceiver; 3-state | Production | |
| 74LVC8T245BZ | 8-bit dual supply translating transceiver; 3-state | Production |
Documentation
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| sot8014-1_3d.png | DHXQFN14: plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Outline 3d | 2021-06-10 |
| 2021-0002_NEX_083_DHXQFN_Leaflet_v05.pdf | Industry’s smallest and thinnest package in 14, 16, 20 and 24 pins for Standard Logic functions | Leaflet | 2021-06-29 |
| SOT8016-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT8014-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8020-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| vp_DHXQFN.zip | DHXQFN | Value proposition | 2024-10-04 |
| DHXQFN14_SOT814-1_mk.png | DHXQFN14 MARCOM image | Marcom graphics | 2025-03-11 |