SOT339-1

plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body

封装版本	封装名称	封装说明	参考	发行日期
SOT339-1	SSOP20	plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body	MO-150 (JEDEC)	2003-02-19

文件名称	标题	类型	日期
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
SOT339-1	plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body	Package information	2020-04-21
SOT339-1_118	SSOP20; Reel pack for SMD, 13''; Q1/T1 product orientation	Packing information	2020-04-21
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08

型号	描述	快速访问

型号	描述	快速访问