外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8024-1 | DHXQFN24 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
|
描述 NEVB-LOGIC04 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
|
类型 Evaluation board
|
Quick links
|
Shop link
|
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8024-1 | 3D model for products with SOT8024-1 package | Design support | 2023-02-02 |
| SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1_115 | DHXQFN24; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2025-10-27 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| 74AVC8T245BZ | 8-bit dual supply translating transceiver with configurable voltage translation; 3-state | |
| 74LVC8T245BZ | 8-bit dual supply translating transceiver; 3-state |