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封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74ABT16273DGG | 74ABT16273DGG,112 (935203320112) |
Obsolete | ABT16273 Standard Procedure Standard Procedure |
![]() TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
暂无信息 |
74ABT16273DGG,118 (935203320118) |
Obsolete | ABT16273 Standard Procedure Standard Procedure | SOT362-1_118 | ||||
74ABT16273DGG,512 (935203320512) |
Obsolete | ABT16273 Standard Procedure Standard Procedure | 暂无信息 | ||||
74ABT16273DGG,518 (935203320518) |
Obsolete | ABT16273 Standard Procedure Standard Procedure | 暂无信息 |
环境信息
下表中的所有产品型号均已停产 。
文档 (6)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
abt16 | abt16 Spice model | SPICE model | 2013-05-07 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.