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Click here for more informationPEMI2QFN-RK
Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
The devices are a family of RC low pass filters. They are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. The devices incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to ±25 kV.
The devices are fabricated using monolithic silicon technology in lead-free plastic packages.
Type number | Package | Number of channels | Package pitch (mm) | Package configuration |
|---|---|---|---|---|
PEMI1QFN | SOT883 | 1 | - | 3-pin MicroPak (QFN compatible) |
PEMI2QFN | SOT886 | 2 | 0.5 | 6-pin MicroPak (QFN compatible) |
PEMI2STD | SOT665 | 1 | - | 5-pin microlead |
PEMI4QFN | SOT1157-1 | 4 | 0.4 | 8-pin extremely thin leadless |
PEMI6QFN | SOT1158-1 | 6 | 0.4 | 12-pin extremely thin leadless |
PEMI8QFN | SOT1159-1 | 8 | 0.4 | 16-pin extremely thin leadless |
Features and benefits
- Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)
- Integrated 1-, 2-, 4-, 6- and 8-channel π-type RC filter network
- ESD protection up to ±25 kV contact discharge according to IEC 61000-4-2, far exceeding level 4
Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for:
- Cellular phone and Personal Communication Systems (PCS) mobile handsets
- Cordless telephones
- Wireless data (WAN/LAN) systems
封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PEMI2QFN-RK | PEMI2QFN/RK,115 (934064103115) |
Obsolete |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
环境信息
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PEMI2QFN-RK | PEMI2QFN/RK,115 | PEMI2QFN-RK |
|
|
文档 (8)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.