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74AUP3G17GN

Low-power triple Schmitt trigger

The 74AUP3G17 provides three Schmitt trigger buffers. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 Product status VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Rth(j-c) (K/W) Package name
74AUP3G17GN Production 0.8 - 3.6 CMOS ± 1.9 70 3 ultra low -40~125 238 148 XSON8

PCB Symbol, Footprint and 3D Model

Model Name 描述

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP3G17GN 74AUP3G17GNX
(935307192115)
Active pV SOT1116
XSON8
(SOT1116)
SOT1116 REFLOW_BG-BD-1
SOT1116_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP3G17GN 74AUP3G17GNX 74AUP3G17GN rohs rhf rhf
品质及可靠性免责声明

文档 (11)

文件名称 标题 类型 日期
74AUP3G17 Low-power triple Schmitt trigger Data sheet 2023-07-31
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
aup3g17 74AUP3G17 IBIS model IBIS model 2015-12-13
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SOT1116 plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body Package information 2022-06-02
SOT1116_115 XSON8 ; Reel pack for SMD, 7''; Q1/T1 product orientation Packing information 2020-04-21
74AUP3G17GN_Nexperia_Product_Reliability 74AUP3G17GN Nexperia Product Reliability Quality document 2023-05-29
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT1116 MAR_SOT1116 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
aup3g17 74AUP3G17 IBIS model IBIS model 2015-12-13
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02

PCB Symbol, Footprint and 3D Model

Model Name 描述

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
74AUP3G17GN 74AUP3G17GNX 935307192115 Active SOT1116_115 5,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
74AUP3G17GN 74AUP3G17GNX 935307192115 SOT1116 订单产品