双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

SiC power devices

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC07A

Hex buffer with open-drain outputs

The 74LVC07A is a hex buffer with open-drain outputs. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

Features and benefits

  • 5 V tolerant inputs and outputs (open-drain) for interfacing with 5 V logic

  • Wide supply voltage range from 1.2 V to 5.5 V

  • CMOS low power consumption

  • Direct interface with TTL levels

  • Overvoltage tolerant inputs to 5.5 V

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC07ABQ 1.65 - 5.5 CMOS/LVTTL 32 175 6 low -40~125 109 22.5 77 DHVQFN14
74LVC07ABZ 1.65 - 5.5 CMOS/LVTTL low -40~125 DHXQFN14
74LVC07AD 1.65 - 5.5 CMOS/LVTTL 32 175 6 low -40~125 111 22.2 70 SO14
74LVC07APW 1.65 - 5.5 CMOS/LVTTL 32 175 6 low -40~125 143 8.3 70.1 TSSOP14

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC07ABQ 74LVC07ABQ/G410X
(935693332115)
Development VC07A SOT762-1
DHVQFN14
(SOT762-1)
SOT762-1 SOT762-1_115
74LVC07ABQ/GX
(935693331115)
Development VC07A SOT762-1_115
74LVC07ABQ,115
(935273332115)
Active VC07A SOT762-1_115
74LVC07ABZ 74LVC07ABZZ
(935692217147)
Active V07 SOT8014-1
DHXQFN14
(SOT8014-1)
SOT8014-1 SOT8014-1_147
74LVC07AD 74LVC07AD,118
(935265481118)
Active 74LVC07AD SOT108-1
SO14
(SOT108-1)
SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74LVC07APW 74LVC07APW/G500J
(935693335118)
Development LVC07A SOT402-1
TSSOP14
(SOT402-1)
SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118
74LVC07APW/G400J
(935693334118)
Development LVC07A SOT402-1_118
74LVC07APW,118
(935265482118)
Active LVC07A SOT402-1_118

下表中的所有产品型号均已停产 。

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC07AD 74LVC07AD,112
(935265481112)
Withdrawn / End-of-life 74LVC07AD SOT108-1
SO14
(SOT108-1)
SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_112

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC07ABQ 74LVC07ABQ/G410X 74LVC07ABQ rohs rhf rhf
74LVC07ABQ 74LVC07ABQ/GX 74LVC07ABQ rohs rhf rhf
74LVC07ABQ 74LVC07ABQ,115 74LVC07ABQ rohs rhf rhf
74LVC07ABZ 74LVC07ABZZ 74LVC07ABZ rohs rhf rhf
74LVC07AD 74LVC07AD,118 74LVC07AD rohs rhf rhf
74LVC07APW 74LVC07APW/G500J 74LVC07APW rohs rhf rhf
74LVC07APW 74LVC07APW/G400J 74LVC07APW rohs rhf rhf
74LVC07APW 74LVC07APW,118 74LVC07APW rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC07AD 74LVC07AD,112 74LVC07AD rohs rhf rhf
品质及可靠性免责声明

文档 (23)

文件名称 标题 类型 日期
74LVC07A Hex buffer with open-drain outputs Data sheet 2025-05-06
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN263 Power considerations when using CMOS and BiCMOS logic devices Application note 2023-02-07
AN90063 Questions about package outline drawings Application note 2026-06-17
mna535 Block diagram: 74LVC07ABQ, 74LVC07AD, 74LVC07APW Block diagram 2009-11-03
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT8014-1 3D model for products with SOT8014-1 package Design support 2023-02-02
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
lvc07a lvc07a IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT8014-1 plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm Package information 2023-02-28
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
lvc lvc Spice model SPICE model 2013-05-07
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT8014-1 3D model for products with SOT8014-1 package Design support 2023-02-02
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
lvc07a lvc07a IBIS model IBIS model 2013-04-08
lvc lvc Spice model SPICE model 2013-05-07

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