 
XC7SET125
Bus buffer/line driver; 3-state
XC7SET125 is a high-speed Si-gate CMOS devices. It provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH at OE causes the output to assume a high-impedance OFF-state.
Features and benefits
- Symmetrical output impedance 
- High noise immunity 
- Low power dissipation 
- Balanced propagation delays 
- TTL input levels 
- ESD protection: - HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V 
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V 
 
- Multiple package options 
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C 
参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | 
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7SET125GM | 4.5 - 5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 318 | 7.4 | 161 | XSON6 | 
| XC7SET125GV | 4.5 - 5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 276 | 58.2 | 173 | TSOP5 | 
| XC7SET125GW | 4.5 - 5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 317 | 86 | 186 | TSSOP5 | 
封装
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| XC7SET125GM | XC7SET125GM,115 (935289889115) | Active | gM |   XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_115 | 
| XC7SET125GM,132 (935289889132) | Active | gM | SOT886_132 | ||||
| XC7SET125GV | XC7SET125GV,125 (935289891125) | Active | g25 |   TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | 
| XC7SET125GW | XC7SET125GW,125 (935289892125) | Active | gM |   TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | 
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| XC7SET125GF | XC7SET125GF,132 (935289888132) | Obsolete | gM |   XSON6 (SOT891) | SOT891 | REFLOW_BG-BD-1 | SOT891_132 | 
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 
|---|---|---|---|---|
| XC7SET125GM | XC7SET125GM,115 | XC7SET125GM |  |   | 
| XC7SET125GM | XC7SET125GM,132 | XC7SET125GM |  |   | 
| XC7SET125GV | XC7SET125GV,125 | XC7SET125GV |  |   | 
| XC7SET125GW | XC7SET125GW,125 | XC7SET125GW |  |   | 
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 
|---|---|---|---|---|
| XC7SET125GF | XC7SET125GF,132 | XC7SET125GF |  |   | 
文档 (23)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| XC7SET125 | Bus buffer/line driver; 3-state | Data sheet | 2023-12-15 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 | 
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 | 
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 | 
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 | 
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 | 
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 | 
| xc7set125 | xc7set125 IBIS model | IBIS model | 2013-04-09 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 | 
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 | 
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 | 
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 | 
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 | 
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 | 
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 | 
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 | 
支持
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模型
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 | 
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 | 
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 | 
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 | 
| xc7set125 | xc7set125 IBIS model | IBIS model | 2013-04-09 | 
Ordering, pricing & availability
样品
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