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74AUP2G16

Low-power dual buffer

The 74AUP2G16 provides two low-power, low-voltage buffers.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP2G16GMProduction0.8 - 3.6CMOS± 1.9702ultra low-40~125290145XSON6
74AUP2G16GWProduction0.8 - 3.6CMOS± 1.9702ultra low-40~125264153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP2G16GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_125Active5A74AUP2G16GMH
( 9353 075 48125 )
74AUP2G16GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125Active5A74AUP2G16GWH
( 9353 075 47125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G16GM74AUP2G16GMH74AUP2G16GMAlways Pb-free
74AUP2G16GW74AUP2G16GWH74AUP2G16GWAlways Pb-free
品质及可靠性免责声明

文档 (8)

文件名称标题类型日期
74AUP2G16Low-power dual bufferData sheet2023-07-26
aup2g1674AUP2G16 IBIS modelIBIS model2015-10-29
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup2g1674AUP2G16 IBIS modelIBIS model2015-10-29

订购、定价与供货

样品

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