Nexperia
Or cross multiple parts
×

74AUP1G0832

Low-power 3-input AND-OR gate

The 74AUP1G0832 is a single 3-input AND-OR gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G0832GMProduction0.8 - 3.6CMOS± 1.96.7701ultra low-40~1252906.5145XSON6
74AUP1G0832GNProduction0.8 - 3.6CMOS± 1.96.7701ultra low-40~12527511.7171XSON6
74AUP1G0832GSProduction0.8 - 3.6CMOS± 1.96.7701ultra low-40~12527214.8177XSON6
74AUP1G0832GWProduction0.8 - 3.6CMOS± 1.96.7701ultra low-40~12526438.6153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G0832GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaY74AUP1G0832GM,132
( 9352 806 19132 )
SOT886_115ActiveaY74AUP1G0832GM,115
( 9352 806 19115 )
74AUP1G0832GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaY74AUP1G0832GN,132
( 9352 917 17132 )
74AUP1G0832GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaY74AUP1G0832GS,132
( 9352 928 32132 )
74AUP1G0832GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveaY74AUP1G0832GW,125
( 9352 806 18125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G0832GM74AUP1G0832GM,13274AUP1G0832GMAlways Pb-free
74AUP1G0832GM74AUP1G0832GM,11574AUP1G0832GMAlways Pb-free
74AUP1G0832GN74AUP1G0832GN,13274AUP1G0832GNAlways Pb-free
74AUP1G0832GS74AUP1G0832GS,13274AUP1G0832GSAlways Pb-free
74AUP1G0832GW74AUP1G0832GW,12574AUP1G0832GWAlways Pb-free
品质及可靠性免责声明

文档 (17)

文件名称标题类型日期
74AUP1G0832Low-power 3-input AND-OR gateData sheet2023-07-13
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g0832aup1g0832 IBIS modelIBIS model2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_document_Logic_CombinationLogic_infocard_201710Combination logic solutions cardLeaflet2017-10-16
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
aup1g0832aup1g0832 IBIS modelIBIS model2014-12-21

订购、定价与供货

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。