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74AUP1G885

Low-power dual function gate

The 74AUP1G885 is a dual function gate. The output state of the outputs (1Y, 2Y) is determined by the inputs (A, B and C). The output 1Y provides the Boolean function: 1Y = A × C. The output 2Y provides the Boolean function: 2Y = A × B + A × C.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD78 Class II

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G885DCProduction0.8 - 3.6CMOS± 1.97.6701ultra low-40~12520334.1113VSSOP8
74AUP1G885GNProduction0.8 - 3.6CMOS± 1.97.6701ultra low-40~12523810.6148XSON8
74AUP1G885GSProduction0.8 - 3.6CMOS± 1.97.6701ultra low-40~12527610.8146XSON8
74AUP1G885GTProduction0.8 - 3.6CMOS± 1.97.6701ultra low-40~1253276.1157XSON8

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G885DC
VSSOP8
(SOT765-1) 		SOT765-1SOT765-1_125ActivepS874AUP1G885DC,125
( 9352 807 65125 )
74AUP1G885GN
XSON8
(SOT1116) 		SOT1116REFLOW_BG-BD-1
SOT1116_115Active5874AUP1G885GN,115
( 9352 922 16115 )
74AUP1G885GS
XSON8
(SOT1203) 		SOT1203REFLOW_BG-BD-1
SOT1203_115Active5874AUP1G885GS,115
( 9352 927 77115 )
74AUP1G885GT
XSON8
(SOT833-1) 		SOT833-1SOT833-1_115ActivepS874AUP1G885GT,115
( 9352 807 67115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G885DC74AUP1G885DC,12574AUP1G885DCAlways Pb-free
74AUP1G885GN74AUP1G885GN,11574AUP1G885GNAlways Pb-free
74AUP1G885GS74AUP1G885GS,11574AUP1G885GSAlways Pb-free
74AUP1G885GT74AUP1G885GT,11574AUP1G885GTAlways Pb-free
品质及可靠性免责声明

文档 (16)

文件名称标题类型日期
74AUP1G885Low-power dual function gateData sheet2023-07-28
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g885aup1g885 IBIS modelIBIS model2013-04-07
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_document_Logic_CombinationLogic_infocard_201710Combination logic solutions cardLeaflet2017-10-16
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1g885aup1g885 IBIS modelIBIS model2013-04-07

订购、定价与供货

样品

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