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74AUP1G00

Low-power 2-input NAND gate

The 74AUP1G00 is a single 2-input NAND gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Multiple package options

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G00GMProduction0.8 - 3.6CMOS± 1.98.3701ultra low-40~1253117.7157XSON6
74AUP1G00GNProduction0.8 - 3.6CMOS± 1.98.3701ultra low-40~12533422.6207XSON6
74AUP1G00GSProduction0.8 - 3.6CMOS± 1.98.3701ultra low-40~12532128.7215XSON6
74AUP1G00GWProduction0.8 - 3.6CMOS± 1.98.3701ultra low-40~12530979.2179TSSOP5
74AUP1G00GXProduction0.8 - 3.6CMOS± 1.98.3701ultra low-40~12532290.7191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G00GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_115ActivepA74AUP1G00GM,115
( 9352 789 96115 )
SOT886_132ActivepA74AUP1G00GM,132
( 9352 789 96132 )
74AUP1G00GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepA74AUP1G00GN,132
( 9352 917 12132 )
74AUP1G00GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepA74AUP1G00GS,132
( 9352 915 34132 )
74AUP1G00GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepA74AUP1G00GW,125
( 9352 789 98125 )
74AUP1G00GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActivepA74AUP1G00GX,125
( 9352 983 53125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1G00GM935278996125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G00GM74AUP1G00GM,11574AUP1G00GMAlways Pb-free
74AUP1G00GM74AUP1G00GM,13274AUP1G00GMAlways Pb-free
74AUP1G00GN74AUP1G00GN,13274AUP1G00GNAlways Pb-free
74AUP1G00GS74AUP1G00GS,13274AUP1G00GSAlways Pb-free
74AUP1G00GW74AUP1G00GW,12574AUP1G00GWAlways Pb-free
74AUP1G00GX74AUP1G00GX,12574AUP1G00GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G00Low-power 2-input NAND gateData sheet2023-07-11
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g0074AUP1G00 IBIS modelIBIS model2014-12-04
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

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模型

文件名称标题类型日期
aup1g0074AUP1G00 IBIS modelIBIS model2014-12-04

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