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74AUP1G32

Low-power 2-input OR-gate

The 74AUP1G32 is a single 2-input OR gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G32GMProduction0.8 - 3.6CMOS± 1.97.9701ultra low-40~1253117.7157XSON6
74AUP1G32GNProduction0.8 - 3.6CMOS± 1.97.9701ultra low-40~12533422.6207XSON6
74AUP1G32GSProduction0.8 - 3.6CMOS± 1.97.9701ultra low-40~12532128.7215XSON6
74AUP1G32GWProduction0.8 - 3.6CMOS± 1.97.9701ultra low-40~12530979.2179TSSOP5
74AUP1G32GXProduction0.8 - 3.6CMOS± 1.97.9701ultra low-40~12532290.7191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G32GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepG74AUP1G32GM,132
( 9352 790 27132 )
SOT886_115ActivepG74AUP1G32GM,115
( 9352 790 27115 )
74AUP1G32GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepG74AUP1G32GN,132
( 9352 917 35132 )
74AUP1G32GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepG74AUP1G32GS,132
( 9352 928 59132 )
74AUP1G32GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepG74AUP1G32GW,125
( 9352 790 26125 )
74AUP1G32GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActivepG74AUP1G32GX,125
( 9352 983 62125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G32GM74AUP1G32GM,13274AUP1G32GMAlways Pb-free
74AUP1G32GM74AUP1G32GM,11574AUP1G32GMAlways Pb-free
74AUP1G32GN74AUP1G32GN,13274AUP1G32GNAlways Pb-free
74AUP1G32GS74AUP1G32GS,13274AUP1G32GSAlways Pb-free
74AUP1G32GW74AUP1G32GW,12574AUP1G32GWAlways Pb-free
74AUP1G32GX74AUP1G32GX,12574AUP1G32GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G32Low-power 2-input OR-gateData sheet2023-07-13
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g3274AUP1G32 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

支持

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模型

文件名称标题类型日期
aup1g3274AUP1G32 IBIS modelIBIS model2014-12-14

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