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PBSS5130PAP

30 V, 1 A PNP/PNP low VCEsat transistor

PNP/PNP low VCEsat transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

NPN/PNP complement: PBSS4130PANP

NPN/NPN complement: PBSS4130PAN

Features and benefits

  • Very low collector-emitter saturation voltage VCEsat

  • High collector current capability IC and ICM

  • High collector current gain hFE at high IC

  • Reduced Printed-Circuit Board (PCB) requirements

  • High energy efficiency due to less heat generation

Applications

  • Load switch

  • Battery-driven devices

  • Power management

  • Charging circuits

  • Power switches (e.g. motors, fans)

参数类型

型号 Package version Package name Size (mm) Polarity Configuration Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] Tj [max] (°C) fr [min] (MHz) Automotive qualified
PBSS5130PAP SOT1118 DFN2020-6 2 x 2 x 0.65 PNP 2 370 -30 -1000 250 150 65 N

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PBSS5130PAP PBSS5130PAP,115
(934066881115)
Active 2E SOT1118
DFN2020-6
(SOT1118)
SOT1118 REFLOW_BG-BD-1
SOT1118_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PBSS5130PAP PBSS5130PAP,115 PBSS5130PAP rohs rhf rhf
品质及可靠性免责声明

文档 (10)

文件名称 标题 类型 日期
PBSS5130PAP 30 V, 1 A PNP/PNP low VCEsat (BISS) transistor Data sheet 2017-05-29
SOT1118 3D model for products with SOT1118 package Design support 2019-10-07
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020-6_SOT1118_mk plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1118 plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-06-02
SOT1118_115 DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation Packing information 2020-06-12
PBSS5130PAP_Nexperia_Product_Quality PBSS5130PAP Nexperia Product Quality Quality document 2019-05-20
PBSS5130PAP_Nexperia_Product_Reliability PBSS5130PAP Nexperia Product Reliability Quality document 2023-04-04
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PBSS5130PAP PBSS5130PAP SPICE model SPICE model 2024-03-26

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PBSS5130PAP PBSS5130PAP SPICE model SPICE model 2024-03-26
SOT1118 3D model for products with SOT1118 package Design support 2019-10-07

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PBSS5130PAP PBSS5130PAP,115 934066881115 Active SOT1118_115 3,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PBSS5130PAP PBSS5130PAP,115 934066881115 SOT1118 订单产品