双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1G06-Q100

Inverter with open-drain output

The 74LVC1G06 is a single inverter with open-drain output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Overvoltage tolerant inputs to 5.5 V

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC1G06GV-Q100 1.65 - 5.5 CMOS/LVTTL 32 175 1 low -40~125 278 68.5 175 TSOP5
74LVC1G06GW-Q100 1.65 - 5.5 CMOS/LVTTL 32 175 1 low -40~125 319 88 188 TSSOP5
74LVC1G06GZ-Q100 1.65 - 5.5 CMOS/LVTTL low -40~125 XSON5

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1G06GV-Q100 74LVC1G06GV-Q100H
(935299326125)		 Active V06 SOT753
TSOP5
(SOT753) 		SOT753 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125
74LVC1G06GW-Q100 74LVC1G06GW-Q100H
(935299327125)		 Active VR SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74LVC1G06GZ-Q100 74LVC1G06GZ-Q100YL
(935691738315)		 Active VR SOT8065-1
XSON5
(SOT8065-1) 		SOT8065-1 SOT8065-1_315

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1G06GV-Q100 74LVC1G06GV-Q100H 74LVC1G06GV-Q100 rohs rhf rhf
74LVC1G06GW-Q100 74LVC1G06GW-Q100H 74LVC1G06GW-Q100 rohs rhf rhf
74LVC1G06GZ-Q100 74LVC1G06GZ-Q100YL 74LVC1G06GZ-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (19)

文件名称 标题 类型 日期
74LVC1G06_Q100 Inverter with open-drain output Data sheet 2024-09-23
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN90063 Questions about package outline drawings Application note 2025-06-13
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
lvc1g06 74LVC1G06 IBIS model IBIS model 2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
Leaflet_SOT8065_Minilogic Leaflet_SOT8065 Minilogic Leaflet 2024-11-15
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT753 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Package information 2022-05-31
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT8065-1 Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm Package information 2024-08-28
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT753 MAR_SOT753 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

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模型

文件名称 标题 类型 日期
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
lvc1g06 74LVC1G06 IBIS model IBIS model 2014-10-20

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