参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74ALVC541BQ-Q100 | 1.65 - 3.6 | LVTTL | ± 24 | 130 | 8 | low | -40~85 | 77 | 8.4 | 49 | DHVQFN20 |
| 74ALVC541D-Q100 | 1.65 - 3.6 | LVTTL | ± 24 | 130 | 8 | low | -40~85 | 84 | 26.7 | 60 | SO20 |
| 74ALVC541PW-Q100 | 1.65 - 3.6 | LVTTL | ± 24 | 130 | 8 | low | -40~85 | 100 | 4.5 | 44.2 | TSSOP20 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74ALVC541BQ-Q100 | 74ALVC541BQ-Q100X (935303991115) |
Active | ALVC541 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74ALVC541D-Q100 | 74ALVC541D-Q100J (935300764118) |
Active | 74ALVC541D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74ALVC541PW-Q100 | 74ALVC541PW-Q100J (935300765118) |
Active | ALVC541 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVC541BQ-Q100 | 74ALVC541BQ-Q100X | 74ALVC541BQ-Q100 |
|
|
| 74ALVC541D-Q100 | 74ALVC541D-Q100J | 74ALVC541D-Q100 |
|
|
| 74ALVC541PW-Q100 | 74ALVC541PW-Q100J | 74ALVC541PW-Q100 |
|
|
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74ALVC541_Q100 | Octal buffer/line driver; 3-state | Data sheet | 2023-07-11 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| alvc541 | alvc541 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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