双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74CBTLV3245-Q100

8-bit bus switch with output enable

The 74CBTLV3245-Q100 is an 8-pole, single-throw bus switch. The device features a single output enable input (OE) that controls eight switch channels. The switches are disabled when OE is HIGH. Schmitt-trigger action at control inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Supply voltage range from 2.3 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • 5 Ω switch connection between two ports

  • Rail to rail switching on data I/O ports

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA per JESD78B Class I level A

  • IOFF circuitry provides partial Power-down mode operation

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

型号 VCC (V) RON (Ω) Logic switching levels tpd (ns) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74CBTLV3245BQ-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 76 7.3 47 DHVQFN20
74CBTLV3245PW-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 99 4.3 43.4 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74CBTLV3245BQ-Q100 74CBTLV3245BQ-Q10X
(935308527115)		 Active BTLV3245 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74CBTLV3245PW-Q100 74CBTLV3245PW-Q10J
(935308526118)		 Active TLV3245 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74CBTLV3245BQ-Q100 74CBTLV3245BQ-Q10X 74CBTLV3245BQ-Q100 rohs rhf rhf
74CBTLV3245PW-Q100 74CBTLV3245PW-Q10J 74CBTLV3245PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (11)

文件名称 标题 类型 日期
74CBTLV3245_Q100 8-bit bus switch with output enable Data sheet 2024-06-24
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
cbtlv3245 74CBTLV3245 IBIS Model IBIS model 2013-11-11
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
cbtlv3245 74CBTLV3245 IBIS Model IBIS model 2013-11-11

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