双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1G66-Q100

Bilateral switch

The 74LVC1G66-Q100 is a single-pole, single-throw analog switch with two input/output terminals (nY and nZ) and a digital enable input (nE). When nE is LOW, the analog switch is turned off. Control inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at control inputs makes the circuit tolerant of slower input rise and fall times.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Very low ON resistance:

    • 7.5 Ω (typical) at VCC = 2.7 V

    • 6.5 Ω (typical) at VCC = 3.3 V

    • 6 Ω (typical) at VCC = 5 V

  • Switch current capability of 32 mA

  • High noise immunity

  • CMOS low power consumption

  • TTL interface compatibility at 3.3 V

  • Overvoltage tolerant control inputs to 5.5 V

  • Latch-up performance meets requirements of JESD78 Class I

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

参数类型

型号 Configuration VCC (V) RON (Ω) Logic switching levels Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC1G66GV-Q100 SPST-NO 1.65 - 5.5 15 CMOS/LVTTL very low -40~125 258 56.2 160 TSOP5
74LVC1G66GW-Q100 SPST-NO 1.65 - 5.5 15 CMOS/LVTTL very low -40~125 299 71.1 171 TSSOP5
74LVC1G66GZ-Q100 1.65 - 5.5 CMOS/LVTTL very low -40~125 XSON5

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1G66GV-Q100 74LVC1G66GV-Q100,1
(935299067125)		 Active V66 SOT753
TSOP5
(SOT753) 		SOT753 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125
74LVC1G66GW-Q100 74LVC1G66GW-Q100,1
(935299068125)		 Active VL SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74LVC1G66GZ-Q100 74LVC1G66GZ-Q100YL
(935691682315)		 Active VL SOT8065-1
XSON5
(SOT8065-1) 		SOT8065-1 SOT8065-1_315

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1G66GM-Q100 74LVC1G66GM-Q100,1
(935299066125)		 Obsolete VL SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1G66GV-Q100 74LVC1G66GV-Q100,1 74LVC1G66GV-Q100 rohs rhf rhf
74LVC1G66GW-Q100 74LVC1G66GW-Q100,1 74LVC1G66GW-Q100 rohs rhf rhf
74LVC1G66GZ-Q100 74LVC1G66GZ-Q100YL 74LVC1G66GZ-Q100 rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1G66GM-Q100 74LVC1G66GM-Q100,1 74LVC1G66GM-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (24)

文件名称 标题 类型 日期
74LVC1G66_Q100 Bilateral switch Data sheet 2024-09-03
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN90063 Questions about package outline drawings Application note 2025-06-13
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
lvc1g66 74LVC1G66 IBIS model IBIS model 2015-02-19
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
Leaflet_SOT8065_Minilogic Leaflet_SOT8065 Minilogic Leaflet 2024-11-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT753 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Package information 2022-05-31
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT8065-1 Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm Package information 2024-08-28
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT753 MAR_SOT753 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
lvc1g66 74LVC1G66 IBIS model IBIS model 2015-02-19

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