可订购部件
| 型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
|---|---|---|---|---|
| BUK9K29-100E | BUK9K29-100E,115 | 934066975115 | SOT1205 | 订单产品 |
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationBUK9K29-100E
Dual N-channel TrenchMOS logic level FET
Dual logic level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package using TrenchMOS technology. This product has been designed and qualified to AEC Q101 standard for use in high performance automotive applications.
Features and benefits
Dual MOSFET
Q101 Compliant
Repetitive avalanche rated
Suitable for thermally demanding environments due to 175 °C rating
True logic level gate with VGS(th) rating of greater than 0.5 V at 175 °C
Applications
12 V Automotive systems
Motors, lamps and solenoid control
Transmission control
Ultra high performance power switching
参数类型
| 型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BUK9K29-100E | SOT1205 | LFPAK56D; Dual LFPAK | Production | N | 2 | 100 | 27 | 29 | 175 | 30 | 10.9 | 68 | 50.1 | 1.7 | Y | 2727 | 169 | 2012-07-23 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BUK9K29-100E | BUK9K29-100E,115 (934066975115) |
Active | 92910E |
LFPAK56D; Dual LFPAK (SOT1205) |
SOT1205 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT1205_115 |
文档 (25)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BUK9K29-100E | Dual N-channel TrenchMOS logic level FET | Data sheet | 2017-04-20 |
| AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
| AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
| AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
| AN11156 | Using Power MOSFET Zth Curves | Application note | 2021-01-04 |
| AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2025-02-18 |
| AN11158_ZH | Understanding power MOSFET data sheet parameters | Application note | 2021-01-04 |
| AN11160 | Designing RC Snubbers | Application note | 2024-10-21 |
| AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2025-03-20 |
| AN11261 | RC Thermal Models | Application note | 2021-03-18 |
| AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| AN90003 | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
| SOT1205 | 3D model for products with SOT1205 package | Design support | 2017-06-30 |
| nexperia_document_leaflet_LFPAK56D_factsheet_LR_201708 | LFPAK56D the ultimate dual MOSFET | Leaflet | 2017-08-17 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56D_SOT1205_mk | plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body | Marcom graphics | 2017-01-28 |
| BUK9xxxx-100E_LTspice_V3 | BUK9xxxx-100E Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-12-14 |
| SOT1205 | plastic, single ended surface mounted package (LFPAK56D); 8 leads | Package information | 2022-03-11 |
| SOT1205_115 | LFPAK56D; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2021-01-11 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| BUK9K29-100E | BUK9K29-100E Spice model | SPICE model | 2012-09-12 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
| BUK9K29-100E_RC_Thermal_Model | BUK9K29-100E Thermal design model | Thermal design | 2021-01-18 |
| BUK9K29-100E | BUK9K29-100E Thermal model | Thermal model | 2014-04-16 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BUK9xxxx-100E_LTspice_V3 | BUK9xxxx-100E Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-12-14 |
| BUK9K29-100E | BUK9K29-100E Spice model | SPICE model | 2012-09-12 |
| BUK9K29-100E_RC_Thermal_Model | BUK9K29-100E Thermal design model | Thermal design | 2021-01-18 |
| BUK9K29-100E | BUK9K29-100E Thermal model | Thermal model | 2014-04-16 |
| SOT1205 | 3D model for products with SOT1205 package | Design support | 2017-06-30 |
订购、定价与供货
| 型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
|---|---|---|---|---|---|---|
| BUK9K29-100E | BUK9K29-100E,115 | 934066975115 | Active | SOT1205_115 | 1,500 |
|
样品
作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.