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BC69PAS series

20 V, 2 A PNP medium power transistors

PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

NPN complement: BC68PAS series

特性

  • High collector current capability IC and ICM
  • Reduced Printed-Circuit Board (PCB) area requirements
  • Exposed heat sink for excellent thermal and electrical conductivity
  • AEC-Q101 qualified
  • Two current gain selections
  • Leadless very small SMD plastic package with medium power capability
  • Suitable for Automatic Optical Inspection (AOI) of solder joint

目标应用

  • Linear voltage regulators
  • Battery driven devices
  • MOSFET drivers
  • High-side switches
  • Power management
  • Amplifiers

参数类型

Type numberPackage versionPackage nameSize (mm)PolarityPtot (mW)VCEO [max] (V)IC [max] (mA)hFE [min]hFE [max]fT [min] (MHz)
BC69-16PASSOT1061DDFN2020D-32 x 2 x 0.65PNP420-20-200010025040
BC69-25PASSOT1061DDFN2020D-32 x 2 x 0.65PNP420-20-200016037540
BC69PASSOT1061DDFN2020D-32 x 2 x 0.65PNP420-20-20008537540

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
BC69-16PAS
DFN2020D-3
(SOT1061D)
SOT1061DReel 7” Q1/T1 or Q2/T3ActiveC2BC69-16PASX
( 9340 681 12115 )
BC69-25PAS
DFN2020D-3
(SOT1061D)
SOT1061DReel 7” Q1/T1 or Q2/T3ActiveC3BC69-25PASX
( 9340 681 13115 )
BC69PAS
DFN2020D-3
(SOT1061D)
SOT1061DReel 7” Q1/T1 or Q2/T3ActiveC1BC69PASX
( 9340 681 11115 )

品质、可靠性及化学成分

型号可订购的器件编号化学成分RoHS / RHF无铅转换日期MSLMSL无铅
BC69-16PASBC69-16PASXBC69-16PASAlways Pb-free11
BC69-25PASBC69-25PASXBC69-25PASAlways Pb-free11
BC69PASBC69PASXBC69PASAlways Pb-free11
品质及可靠性免责声明

文档 (5)

文件名称标题类型日期
BC69PAS_Nexperia_Product_QualityBC69PAS Nexperia Product QualityQuality document2019-05-20
BC69PAS_Nexperia_Product_ReliabilityBC69PAS Nexperia Product ReliabilityQuality document2021-03-19
Nexperia_Selection_guide_2020Nexperia Selection Guide 2020Selection guide2020-01-31
BC69PASBC69PAS SPICE modelSPICE model2020-11-11
SOT1061Dplastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm bodyPackage information2020-04-21

支持

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模型

文件名称标题类型日期
BC69PASBC69PAS SPICE modelSPICE model2020-11-11

订购、定价与供货

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

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