PESDxUSB3B

ESD protection for differential data lines

ElectroStatic Discharge (ESD) protection for one, two and three differential channels.

The devices are footprint compatible to PCMFxUSB3B/C common mode filters with ESD protection.

Diodes provide protection to downstream components from ESD voltages up to ±20 kV on each signal line.

Allows switching between PCMFxUSB3B/C common mode filters with ESD protection and PESDxUSB3B/C ESD protection in the same footprint
TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs)
ESD protection for one, two and three differential channels up to ±20 kV contact discharge according to IEC 61000-4-2
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
Bidirectional for audio line option

Smartphone, cellular and cordless phone
USB3.2, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)

Type number	Package version	Package name	Size (mm)	Configuration	Nr of lines	V_RWM (V)	C_d [typ] (pF)	I_PPM [max] (A)	V_ESD (kV)	Product status
PESD1USB3B	WLCSP5_2-1-2	WLCSP5	0.77 x 1.17 x 0.57	Bidirectional	2	4	0.29	9.5	20	Production
PESD2USB3B	WLCSP10_4-2-4	WLCSP10	1.57 x 1.17 x 0.57	Bidirectional	4	4	0.29	9.5	20	Production
PESD3USB3B	WLCSP15_6-3-6	WLCSP15	2.37 x 1.17 x 0.57	Bidirectional	6	4	0.29	9.5	20	Production

型号	封装	尺寸版本	包装	状态	标示	可订购的器件编号，（订购码(12NC)）
PESD1USB3B/C	WLCSP5 (WLCSP5_2-1-2)	WLCSP5_2-1-2	Reel 7" Q2/T3	Active	Standard Marking	PESD1USB3B/CZ ( 9346 602 93087 )
PESD2USB3B/C	WLCSP10 (WLCSP10_4-2-4)	WLCSP10_4-2-4	Reel 7" Q2/T3	Active	Standard Marking	PESD2USB3B/CZ ( 9346 602 94087 )
PESD3USB3B/C	WLCSP15 (WLCSP15_6-3-6)	WLCSP15_6-3-6	Reel 7" Q2/T3	Active	Standard Marking	PESD3USB3B/CZ ( 9346 602 95087 )

下表中的版本已停产。参见表停产信息了解更多信息。

型号	封装	尺寸版本	包装	状态	标示	可订购的器件编号，（订购码(12NC)）
PESD1USB3B/C	WLCSP5 (WLCSP5_2-1-2)	WLCSP5_2-1-2	Reel 7” Q1/T1 or Q2/T3	Withdrawn / End-of-life	Standard Marking	PESD1USB3B/CX ( 9346 602 93115 )
PESD2USB3B/C	WLCSP10 (WLCSP10_4-2-4)	WLCSP10_4-2-4	Reel 7” Q1/T1 or Q2/T3	Withdrawn / End-of-life	Standard Marking	PESD2USB3B/CX ( 9346 602 94115 )
PESD3USB3B/C	WLCSP15 (WLCSP15_6-3-6)	WLCSP15_6-3-6	Reel 7” Q1/T1 or Q2/T3	Withdrawn / End-of-life	Standard Marking	PESD3USB3B/CX ( 9346 602 95115 )

型号	可订购的器件编号	化学成分
PESD1USB3B/C	PESD1USB3B/CZ	暂无信息 You can request this via a support request
PESD2USB3B/C	PESD2USB3B/CZ	暂无信息 You can request this via a support request
PESD3USB3B/C	PESD3USB3B/CZ	暂无信息 You can request this via a support request

下表中的版本已停产。参见表停产信息了解更多信息。

型号	可订购的器件编号	化学成分	无铅转换日期	MSL	MSL无铅
PESD1USB3B/C	PESD1USB3B/CX	暂无信息 You can request this via a support request	week 25, 2019	1	1
PESD2USB3B/C	PESD2USB3B/CX	暂无信息 You can request this via a support request	week 25, 2019	1	1
PESD3USB3B/C	PESD3USB3B/CX	暂无信息 You can request this via a support request	week 25, 2019	1	1

文件名称	标题	类型	日期
PESDXUSB3B_C_SER	ESD protection for differential data lines	Data sheet	2019-01-29
WLCSP5_2-1-2	wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body	Package information	2020-04-21
WLCSP15_6-3-6	wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body	Package information	2020-04-21
WLCSP10_4-2-4	wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body	Package information	2020-04-21

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