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PESDxUSB3B

ESD protection for differential data lines

ElectroStatic Discharge (ESD) protection for one, two and three differential channels.

The devices are footprint compatible to PCMFxUSB3B/C common mode filters with ESD protection.

Diodes provide protection to downstream components from ESD voltages up to ±20 kV on each signal line.

Table 1. Product overview

Type Number

Number of channels

Package name

PESD1USB3B/C

1

WLCSP5

PESD2USB3B/C

2

WLCSP10

PESD3USB3B/C

3

WLCSP15

特性

  • Allows switching between PCMFxUSB3B/C common mode filters with ESD protection and PESDxUSB3B/C ESD protection in the same footprint

  • TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs)

  • ESD protection for one, two and three differential channels up to ±20 kV contact discharge according to IEC 61000-4-2

  • Industry-standard WLCSP5, 10 and 15 packages for smallest footprint

  • Bidirectional for audio line option

目标应用

  • Smartphone, cellular and cordless phone

  • USB3.2, USB2.0, HDMI2.0, HDMI1.4

  • General-purpose downstream ESD protection for differential data lines

  • Tablet PC and Mobile Internet Device (MID)

  • MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)

参数类型

Type numberPackage versionPackage nameSize (mm)ConfigurationNr of linesVRWM (V)Cd [typ] (pF)IPPM [max] (A)VESD (kV)Product status
PESD1USB3BWLCSP5_2-1-2WLCSP50.77 x 1.17 x 0.57Bidirectional240.299.520Production
PESD2USB3BWLCSP10_4-2-4WLCSP101.57 x 1.17 x 0.57Bidirectional440.299.520Production
PESD3USB3BWLCSP15_6-3-6WLCSP152.37 x 1.17 x 0.57Bidirectional640.299.520Production

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
PESD1USB3B/C
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2WLCSP5_2-1-2_087ActiveStandard MarkingPESD1USB3B/CZ
( 9346 602 93087 )
PESD2USB3B/C
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4WLCSP10_4-2-4_087ActiveStandard MarkingPESD2USB3B/CZ
( 9346 602 94087 )
PESD3USB3B/C
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6WLCSP15_6-3-6_087ActiveStandard MarkingPESD3USB3B/CZ
( 9346 602 95087 )

下表中的版本已停产。参见表 停产信息 了解更多信息。

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
PESD1USB3B/C
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2WLCSP5_2-1-2_115Withdrawn / End-of-lifeStandard MarkingPESD1USB3B/CX
( 9346 602 93115 )

停产信息

型号可订购的器件编号,(订购码(12NC))最后一次购买日期最后一次交货日期替代产品状态备注
PESD1USB3B/C934660293115
PESD2USB3B/C934660294115
PESD3USB3B/C934660295115

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
PESD1USB3B/CPESD1USB3B/CZ暂无信息
You can request this via a support request
PESD2USB3B/CPESD2USB3B/CZ暂无信息
You can request this via a support request
PESD3USB3B/CPESD3USB3B/CZ暂无信息
You can request this via a support request

下表中的版本已停产。参见表 停产信息 了解更多信息。

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
PESD1USB3B/CPESD1USB3B/CX暂无信息
You can request this via a support request
week 25, 2019
品质及可靠性免责声明

文档 (4)

文件名称标题类型日期
PESDXUSB3B_C_SERESD protection for differential data linesData sheet2019-01-29
WLCSP5_2-1-2wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm bodyPackage information2020-04-21
WLCSP15_6-3-6wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm bodyPackage information2020-04-21
WLCSP10_4-2-4wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm bodyPackage information2020-04-21

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