About the webinar
This digital webinar will focus on how to increase power density and reliability while reduce size and parasitics using CFP and DFN packages. The webinar will consist of three parts:
- The first part will highlight thermal performance of clip-bonded Clip Flat Power packages (CFP).
- The second part will demonstrate the benefits of Discretes Flat No-Leads packages (DFN) compared to standard leaded SMD packages.
- Lastly, the third part will explain reliability profile ‘tested beyond AECQ-101’ and what is behind Board Level Reliability testing.