探索Nexperia丰富的核心半导体产品组合，这些产品为全球几乎所有商用电子设计的基础功能提供支持——涵盖汽车、工业、移动及消费类应用领域。

所有产品

化学成分 74HCT3G14DC

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
935274771125	74HCT3G14DC,125	74HCT3G14DC	SOT765-1 (VSSOP8)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1239 ppm; substance 7440-02-0: 20054 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1239 ppm; substance 7440-02-0: 20054 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 320 ppm; substance 7440-22-4: 2859 ppm; substance 7440-57-5: 309 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.026881	75.000000	0.269352
Adhesive	Polymer	Resin system		0.006451	18.000000	0.064640
Adhesive	Polymer	Acrylic resin		0.002150	6.000000	0.021543
Adhesive	Additive	Non-declarable		0.000358	1.000000	0.003587
		Adhesive Total		0.035840	100.000000	0.359122

Die	Doped silicon	Silicon (Si)	7440-21-3	0.128616	100.000000	1.288751
		Die Total		0.128616	100.000000	1.288751

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	3.398550	94.231152	34.053976
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.105110	2.914376	1.053218
		Base Alloy C70250 Total		3.503660	97.145528	35.107194
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.095023	2.634695	0.952145
		Pre-Plating 1 Total		0.095023	2.634695	0.952145
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.003191	0.088481	0.031974
		Pre-Plating 2 Total		0.003191	0.088481	0.031974
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.003088	0.085625	0.030942
		Pre-Plating 3 Total		0.003088	0.085625	0.030942
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.001648	0.045671	0.016513
		Pre-Plating 4 Total		0.001648	0.045671	0.016513
		Lead Frame Total		3.606610	100.000000	36.138768

Mould Compound	Filler	Silica fused	60676-86-0	4.842596	78.330000	48.523531
Mould Compound	Polymer	Epoxy resin system		0.547875	8.862000	5.489789
Mould Compound	Flame retardant	Magnesium hydroxide (Mg(OH)2)	1309-42-8	0.377120	6.100000	3.778799
Mould Compound	Polymer	Phenolic resin		0.365250	5.908000	3.659859
Mould Compound	Filler	Silica	7631-86-9	0.037094	0.600000	0.371687
Mould Compound	Pigment	Carbon black	1333-86-4	0.012365	0.200000	0.123899
		Mould Compound Total		6.182300	100.000000	61.947564

Wire	Pure metal	Copper (Cu)	7440-50-8	0.026526	100.000000	0.265795
		Wire Total		0.026526	100.000000	0.265795

		74HCT3G14DC Total		9.979892		100.000000

Notes
Report created on 2026-05-22 13:32:46 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2026-05-22 13:32:46 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Component	有毒有害物质或元素 (Toxic and hazardous substances or elements)
部件名称 Component	Pb (铅) 铅 Lead	Hg (汞) 汞 Mercury	Cd (镉) 镉 Cadmium	Cr⁶⁺ (六价铬) 六价铬 Chromium VI	PBB (多溴联苯) 多溴联苯 Polybrominated biphenyls	PBDE (多溴二苯醚) 多溴二苯醚 Polybrominated diphenyl ethers	DEHP (邻苯二甲酸二(2-乙基己)酯) 邻苯二甲酸二(2-乙基己)酯 Di(2-ethylhexyl) phthalate	BBP (邻苯二甲酸丁苄酯) 邻苯二甲酸丁苄酯 Butyl benzyl phthalate	DBP (邻苯二甲酸二丁酯) 邻苯二甲酸二丁酯 Dibutyl phthalate	DIBP (邻苯二甲酸二异丁酯) 邻苯二甲酸二异丁酯 Diisobutyl phthalate
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
预镀层1 (Pre-Plating 1)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
预镀层2 (Pre-Plating 2)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
预镀层3 (Pre-Plating 3)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
预镀层4 (Pre-Plating 4)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件的所有均质材料中的含量均符合 GB/T 26572 规定的限量要求。 Indicates that the content of the hazardous substance in all homogeneous materials of this part complies with the limit requirements of GB/T 26572.
✕	表示该有害物质在该部件的至少一种均质材料中的含量超过 GB/T 26572 规定的限量要求（如适用，符合相关豁免要求）。 Indicates that the content of the hazardous substance in at least one homogeneous material of this part exceeds the limit requirements of GB/T 26572 (where applicable, in accordance with relevant exemptions).
	该半导体产品符合中国 RoHS 要求，适用"e"标识，环境保护使用期限（EFUP）标识不适用。 This semiconductor product complies with China RoHS requirements and bears the "e" mark; therefore, the Environmental Friendly Use Period (EFUP) marking is not applicable. 注：EFUP 的确定基于产品在正常使用条件下的环境与可靠性评估。 Note: The EFUP is determined based on environmental and reliability assessments under normal operating conditions.

Notes
Report created on 2026-05-22 13:32:46 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.