 
74HCS273
Octal D-type flip-flop with reset and Schmitt-trigger inputs; positive-edge trigger
The 74HCS273 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
Features and benefits
- Wide supply voltage range from 2.0 V to 6.0 V 
- Schmitt-trigger inputs 
- Common clock and master reset 
- Eight positive edge-triggered D-type flip-flops 
- Low power consumption
- Typical supply current (ICC) of 100 nA
- Typical input leakage current (II) of ±10 nA
 
- ±7.8 mA output drive at 6 V
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
- 
Complies with JEDEC standards:- JESD7A (2.0 V to 6.0 V)
 
- ESD protection: - HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V 
- CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V 
 
- Multiple package options 
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C 
参数类型
| 型号 | VCC (V) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name | 
|---|---|---|---|---|---|
| 74HCS273BQ | 2.0 - 6.0 | CMOS | low | -40~125 | DHVQFN20 | 
| 74HCS273PW | 2.0 - 6.0 | CMOS | low | -40~125 | TSSOP20 | 
封装
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| 74HCS273BQ | 74HCS273BQX (935692458115) | Development | S273 |   DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | |
| 74HCS273PW | 74HCS273PWJ (935692456118) | Development | S273 |   TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | 
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 
|---|---|---|---|---|
| 74HCS273BQ | 74HCS273BQX | 74HCS273BQ |  |   | 
| 74HCS273PW | 74HCS273PWJ | 74HCS273PW |  |   | 
文档 (11)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| 74HCS273 | Octal D-type flip-flop with reset and Schmitt-trigger inputs; positive-edge trigger | Data sheet | 2025-10-31 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 | 
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 | 
| 74hcs273 | 74HCS273 IBIS model | IBIS model | 2025-10-31 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 | 
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 | 
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 | 
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 | 
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | 
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