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SOT355-1

TSSOP24 (SOT355-1)

plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT355-1 TSSOP24 plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body MO-153 (JEDEC) 2003-02-19

相关文档

文件名称 标题 类型 日期
SOT355-1 3D model for products with SOT355-1 package Design support 2020-01-22
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

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