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74AUP1G08

Low-power 2-input AND gate

The 74AUP1G08 is a single 2-input AND gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G08GF
NRND 		Not for design in-----------XSON6
74AUP1G08GMProduction0.8 - 3.6CMOS± 1.98.2701ultra low-40~1253117.7157XSON6
74AUP1G08GNProduction0.8 - 3.6CMOS± 1.98.2701ultra low-40~12533422.6207XSON6
74AUP1G08GSProduction0.8 - 3.6CMOS± 1.98.2701ultra low-40~12532128.7215XSON6
74AUP1G08GWProduction0.8 - 3.6CMOS± 1.98.2701ultra low-40~12530979.2179TSSOP5
74AUP1G08GXProduction0.8 - 3.6CMOS± 1.98.2701ultra low-40~12532290.7191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G08GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepE74AUP1G08GM,132
( 9352 790 21132 )
SOT886_115ActivepE74AUP1G08GM,115
( 9352 790 21115 )
74AUP1G08GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepE74AUP1G08GN,132
( 9352 917 18132 )
74AUP1G08GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepE74AUP1G08GS,132
( 9352 928 33132 )
74AUP1G08GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepE74AUP1G08GW,125
( 9352 790 19125 )
74AUP1G08GW/C7
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125Samples available / DevelopmentpE74AUP1G08GW/C7H
( 9356 919 29125 )
74AUP1G08GX
X2SON5
(SOT1226) 		SOT1226REFLOW_BG-BD-1
SOT1226_125ActivepE74AUP1G08GX,125
( 9352 982 27125 )

下表中的版本已停产。参见表 停产信息 了解更多信息。

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G08GF
XSON6
(SOT891) 		SOT891REFLOW_BG-BD-1
SOT891_132Withdrawn / End-of-lifepE74AUP1G08GF,132
( 9352 811 09132 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1G08GF9352811091322021-12-312022-06-3074AUP1G08GS

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1G08GM74AUP1G08GM,13274AUP1G08GMAlways Pb-free
    74AUP1G08GM74AUP1G08GM,11574AUP1G08GMAlways Pb-free
    74AUP1G08GN74AUP1G08GN,13274AUP1G08GNAlways Pb-free
    74AUP1G08GS74AUP1G08GS,13274AUP1G08GSAlways Pb-free
    74AUP1G08GW74AUP1G08GW,12574AUP1G08GWAlways Pb-free
    74AUP1G08GW/C774AUP1G08GW/C7H74AUP1G08GW/C7
    74AUP1G08GX74AUP1G08GX,12574AUP1G08GXAlways Pb-free

    下表中的版本已停产。参见表 停产信息 了解更多信息。

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1G08GF74AUP1G08GF,132暂无信息
    You can request this via a support request    		Always Pb-free
    品质及可靠性免责声明

    文档 (24)

    文件名称标题类型日期
    74AUP1G08Low-power 2-input AND gateData sheet2023-07-12
    AN10161PicoGate Logic footprintsApplication note2002-10-29
    AN11052Pin FMEA for AUP familyApplication note2019-01-09
    aup1g0874AUP1G08 IBIS modelIBIS model2014-12-14
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1226MAR_SOT1226 TopmarkTop marking2013-06-03
    SOT1226plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm bodyPackage information2022-05-30
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    SOT891plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm bodyPackage information2020-04-21
    MAR_SOT891MAR_SOT891 TopmarkTop marking2013-06-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

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    模型

    文件名称标题类型日期
    aup1g0874AUP1G08 IBIS modelIBIS model2014-12-14

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