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74AUP2G38

Low-power dual 2-input NAND gate; open drain

The 74AUP2G38 provides the dual 2-input NAND gate with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD78B Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP2G38DCProduction0.8 - 3.6CMOS1.98.5702ultra low-40~12520334.1113VSSOP8
74AUP2G38GNProduction0.8 - 3.6CMOS1.98.5702ultra low-40~12523810.6148XSON8
74AUP2G38GSProduction0.8 - 3.6CMOS1.98.5702ultra low-40~12527610.8146XSON8
74AUP2G38GTProduction0.8 - 3.6CMOS1.98.5702ultra low-40~1253276.1157XSON8

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP2G38DC
VSSOP8
(SOT765-1) 		SOT765-1SOT765-1_125Activea3874AUP2G38DC,125
( 9352 807 15125 )
74AUP2G38GN
XSON8
(SOT1116) 		SOT1116REFLOW_BG-BD-1
SOT1116_115ActiveaB74AUP2G38GN,115
( 9352 922 27115 )
74AUP2G38GS
XSON8
(SOT1203) 		SOT1203REFLOW_BG-BD-1
SOT1203_115ActiveaB74AUP2G38GS,115
( 9352 927 87115 )
74AUP2G38GT
XSON8
(SOT833-1) 		SOT833-1SOT833-1_115Activea3874AUP2G38GT,115
( 9352 807 16115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G38DC74AUP2G38DC,12574AUP2G38DCAlways Pb-free
74AUP2G38GN74AUP2G38GN,11574AUP2G38GNAlways Pb-free
74AUP2G38GS74AUP2G38GS,11574AUP2G38GSAlways Pb-free
74AUP2G38GT74AUP2G38GT,11574AUP2G38GTAlways Pb-free
品质及可靠性免责声明

文档 (15)

文件名称标题类型日期
74AUP2G38Low-power dual 2-input NAND gate; open drainData sheet2023-07-31
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup2g38aup2g38 IBIS modelIBIS model2013-04-07
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup2g38aup2g38 IBIS modelIBIS model2013-04-07

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样品

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