- 产品细节
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- 支持
- 订购中
- 交互式数据手册
产品细节
Features and benefits
Fully automotive qualified to beyond AEC-Q101:
-55 °C to +175 °C rating suitable for thermally demanding environments
LFPAK88 package:
Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
Thin package and copper clip enables LFPAK88 to be highly efficient thermally
LFPAK copper clip technology enabling improvements over wire bond packages by:
Increased maximum current capability and excellent current spreading
Improved RDSon
Low source inductance
Low thermal resistance Rth
LFPAK Gull Wing leads:
Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
Visual (AOI) soldering inspection, no need for expensive x-ray equipment
Easy solder wetting for good mechanical solder joint
Unique 40 V Trench 9 superjunction technology:
Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
Improved SOA and avalanche capability compared to standard TrenchMOS
Tight VGS(th) limits enable easy paralleling of MOSFETs
Applications
12 V automotive systems
48 V DC/DC systems (on 12 V secondary side)
Higher power motors, lamps and solenoid control
Reverse polarity protection
Ultra high performance power switching
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
More information品质及可靠性免责声明
支持
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Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
样品
作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
交互式数据手册
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
交互式数据手册