参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56-10H | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 725.0 | 80.0 | 1000.0 | 63.0 | 160.0 | 175 | 100.0 | ||||||
| BCP56-16H | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 725.0 | 725 | 80.0 | 80 | 1000.0 | 1000 | 100.0 | 100 | 250.0 | 250 | 175 | 100.0 | 100 |
| BCP56H | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 725.0 | 80.0 | 1000.0 | 63.0 | 250.0 | 175 | 100.0 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BCP56-10H | BCP56-10HX (934070291115) |
Active | P5610H |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP56-16H | BCP56-16HX (934070292115) |
Active | P5616H |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP56H | BCP56HX (934070289115) |
Active | BCP56H |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
文档 (8)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BCP56H_SER | 80 V, 1 A NPN medium power transistors | Data sheet | 2025-01-31 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
