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PMGD400UN

Dual N-channel TrenchMOS ultra low level FET

双超低电平N沟道增强型场效应晶体管(FET),采用使用TrenchMOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。

该产品已停产。参见单击此处了解停产信息和替代产品。

Features and benefits

  • 低导通电阻,因而导通损耗很小
  • 占用面积小,节省PCB空间(比SOT23小40 %)
  • 快速开关特性,适用于高频应用
  • 适用于低栅极驱动源

Applications

  • 驱动电路
  • 便携式设备中的开关

参数类型

型号 Package version Package name Product status Channel type Nr of transistors RDSon [max] @ VGS = 4.5 V (mΩ) RDSon [max] @ VGS = 2.5 V (mΩ) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) Ptot [max] (W) Automotive qualified Release date
PMGD400UN SOT363 TSSOP6 End of life N 2 480 580 0.71 0.2 0.89 0.41 N 2011-01-24

封装

下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PMGD400UN PMGD400UN,115
(934057724115)
Obsolete SOT363
TSSOP6
(SOT363)
SOT363 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT363_115

环境信息

下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PMGD400UN PMGD400UN,115 PMGD400UN rohs rhf rhf
品质及可靠性免责声明

文档 (19)

文件名称 标题 类型 日期
PMGD400UN Dual N-channel uTrenchmos (tm) ultra low level FET Data sheet 2004-03-02
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90032 Low temperature soldering, application study Application note 2022-02-22
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT363 3D model for products with SOT363 package Design support 2018-12-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP6_SOT363_mk plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2017-01-28
SOT363 plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body Package information 2022-06-01
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
MAR_SOT363 MAR_SOT363 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT363 3D model for products with SOT363 package Design support 2018-12-05

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.