庆祝LFPAK问世20周年！
二十年前，Nexperia凭借独具特色的有引脚夹片粘合功率MOSFET一举改变了半导体行业。这项突破性的创新技术名为LFPAK，比市场上任何类型的封装都能实现更低的功率损耗。LFPAK具有革新性，大幅度地改进了性能，为早期采用者所带来的优势超出了他们对MOSFET封装的预期。在20年持续创新的推动下，故事还在继续...
How to choose the right package
A device's internal structure strongly affects the thermal resistance of different semiconductor packages, as do different operating conditions. To ensure circuits' safe and reliable operation and decide for the most appropriate package, designers need to understand thermal parameters and heat dissipation pathways. The blog series “Thermal considerations” guides through different semiconductor package types and the ‘thermal characteristics’ sub-section of the datasheet.
Making semiconductors more resilient with strict testing and new packaging
In this article published on Wevolver, we delve into the fascinating world of semiconductor testing, exploring its evolution, changing operating environments and the need for strict quality control measures. Find out why we believe there are no shortcuts when it comes to robust manufacturing and test processes to ensure product reliability. One example is Nexperia's clip-bonded CFP15B FlatPower package which has passed the stringent Board Level Reliability (BLR) specification at a leading automotive supplier.
