Hot-Swap Architectures and Protection Technologies for High-Current AI Servers
Positioned between the power supply and the CPUs, GPUs and accelerators they support, Power Distribution Boards (PDBs) play a critical role in delivering and protecting power throughout modern AI and hyperscale servers. As power densities continue to increase, designers must balance efficiency, reliability and fault protection while minimizing downtime. Learn how hot-swap architectures, protection technologies and power management solutions help safeguard critical systems and prevent costly board failures.
Date: December 15th, 2026
Time: 10 AM CET & 5 PM CET
Location: Online webinar
Key learnings
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Learn how to improve hot-swap reliability in 48 V server applications.
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Discover solutions for high-current AI and compute workloads.
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Explore MOSFET technologies designed for efficient power distribution.
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Learn how to overcome thermal and reliability challenges.
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Gain insights into designing resilient next-generation server power systems.
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- Meet the speakers
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Meet the speakers
Aniket Kulkarni
Sr. Power Applications Engineer, Nexperia
Aniket joined Nexperia as a Power Applications Engineer in September 2022. Before that, he worked on power electronics at Danfoss Drives’ Product Engineering Centre in Denmark, and earlier developed electric drivetrain components for EVs as a senior R&D engineer at Bajaj Auto. For his Master’s thesis at Aalto University, Finland, he designed a DAB DC-DC converter using GaN devices.
Ramon Zhao
Product Manager Diodes & Transistors, Nexperia
Ramon is the Product Manager for Schottky and Rectifier at Nexperia. With a background in microelectronics and expertise in device physics, packaging and system-level integration, he connects market trends and system challenges with device-level innovation. He currently focuses on Nexperia’s next-generation Trench Schottky platform, which improves switching behavior, EMI, thermal performance and reliability in high-density power architectures.